Method of manufacturing light emitting diode package

• US 8,557,617 B2
• Filed: 02/22/2007
• Issued: 10/15/2013
• Est. Priority Date: 02/22/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Park, Youn Gon, Lee, Jong Myeon, Chang, Myung Whun, Choo, Ho Sung, Lee, Hai Sung
• Primary Examiner(s): Vu, David
• Application Number:
  US11/709,130
• Publication Number:
  US 20070196939A1
• Time in Patent Office: 2,427 Days
• Field of Search: 313/502, 313/506, 438/26, 438/27, 438/29, 257 98-100, 257/788, 257/E33.059, 257/E33.073, 257/E33.074
• US Class Current: 438/29
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Claims

1. A method of manufacturing a light emitting diode package comprising:

preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess;

mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure;

injecting a liquid-state transparent resin into the recess of the package structure;

curing the injected liquid-state transparent resin until the injected liquid-state transparent resin is in a partially cured state;

applying a stamp with a micro rough pattern engraved thereon to an upper surface of the partially cured liquid-state transparent resin before the liquid-state transparent resin is completely cured;

curing the partially cured liquid-state transparent resin with the stamp applied thereto completely to form a resin encapsulant; and

removing the stamp from the resin encapsulant.

2. The method according to claim 1, wherein the step of injecting a liquid-state transparent resin comprises injecting the liquid-state transparent resin in such an amount that the upper surface of the injected liquid-state transparent resin is higher than the upper end of the recess of the package structure.

3. The method according to claim 2, wherein the entire upper surface of the injected liquid-state transparent resin is higher than the upper end of the recess of the package structure.

4. The method according to claim 1, wherein the liquid-state transparent resin has phosphor dispersed therein to convert the wavelength of emitted light.

5. The method according to claim 1, further comprising forming a phosphor film for converting the wavelength of emitted light on a surface of the light emitting diode chip before forming a resin encapsulant.

6. The method according to claim 1, wherein the step of forming a resin encapsulant comprises a deaeration process to remove bubbles in the liquid-state transparent resin with the stamp applied to the liquid-state transparent resin.

7. The method according to claim 1, wherein the stamp comprises a planar structure with the micro rough pattern engraved on a surface thereof.

8. The method according to claim 1, wherein the micro rough pattern engraved on the stamp comprises a plurality of triangular prisms arranged in one direction.

9. The method according to claim 1, wherein the rough pattern engraved on the stamp comprises a plurality of quadrangular pyramids arranged in lines and rows.

10. The method according to claim 1, further comprising applying a release agent on a surface of the stamp that comes in contact with the transparent resin before applying the stamp.