Light emitting device

• US 8,558,270 B2
• Filed: 05/11/2011
• Issued: 10/15/2013
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Seo, Eun Jung, Cho, Jae Ho, Kim, Bang Hyun
• Primary Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US13/105,549
• Publication Number:
  US 20110210366A1
• Time in Patent Office: 888 Days
• Field of Search: 257/98, 257/99, 257/E33.059, 257/100
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Claims

1. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first surface, a second surface opposite to the first surface, and sidewalls arranged between the first surface and the second surface thereof, wherein at least one of the first and second lead frames comprises an inset sidewall, the inset sidewall undercutting at least one of the first surface and the second surface and at least partially defining a fixing space;

a light-emitting diode chip arranged on the first surface of the first or second lead frames; and

a molding unit disposed on the first surfaces of the first and second lead frames and in the fixing space, the molding unit covering the light-emitting diode chip,

wherein the fixing space is continuously disposed along three sides of at least one of the first and second lead frames.

2. The light-emitting device of claim 1, wherein the first lead frame comprises an inset sidewall and the second lead frame comprises a fixing hole.

3. The light-emitting device of claim 1, wherein the first surface and the second surface of the at least one of the first and second lead frames have different surface areas from each other.

4. The light-emitting device of claim 1, wherein at least one sidewall of the first or second lead frame is inclined, and a corresponding first surface and second surface of the first or second lead frame comprise different surface areas from each other.

5. The light-emitting device of claim 1, further comprising a reflector arranged on the first surface of each of the first and second lead frames, the reflector surrounding the light-emitting diode chip.

6. The light-emitting device of claim 1, wherein the molding unit comprises a phosphor disposed therein.

7. The light-emitting device of claim 1, wherein each of the first and second lead frames comprises an inset sidewall.

8. The light-emitting device of claim 1, wherein the sidewalls comprise a stepped structure.

9. The light-emitting device of claim 8, wherein the stepped structure is continuously arranged along at least one of three sides of at least one of the first and second lead frames.

10. The light-emitting device of claim 1, wherein the at least one of the first and second lead frames comprises a fixing hole, the fixing hole extending from the first surface to the fixing space.

11. The light-emitting device of claim 10, wherein the sidewalls comprise a stepped structure.

12. The light-emitting device of claim 10, wherein the sidewalls are inclined.

13. The light-emitting device of claim 10, wherein the inset sidewall comprises a concave portion, wherein the concave portion at least partially surrounds the fixing hole.