Flip chip package and method of manufacturing the same

• US 8,558,360 B2
• Filed: 10/27/2010
• Issued: 10/15/2013
• Est. Priority Date: 10/28/2009
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Ey Yong, Shin, Young Hwan, Cho, Soon Jin, Kim, Jong Yong, Lee, Jin Seok
• Primary Examiner(s): Lebentritt, Michael
• Application Number:
  US12/926,137
• Publication Number:
  US 20110095421A1
• Time in Patent Office: 1,084 Days
• Field of Search: 257668-787, 257E21499-502, 257/23.08, 257 65- 68, 257/125
• US Class Current: 257/669
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/26175 Flow barriers
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor

Abstract

There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.

Claims

1. A flip chip package comprising:

an electronic device;

a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region;

a resin layer disposed on the board and including a trench formed by removing a part of the resin layer; and

a dam member provided on the trench and preventing leakage of an underfill between the mounting region and the connection pad.

2. The flip chip package of claim 1, wherein the trench is formed by processing the resin layer using a laser.

3. The flip chip package of claim 1, wherein the trench is formed by exposing and developing the resin layer.

4. The flip chip package of claim 3, wherein the resin layer is formed of a photoresist resin.

5. The flip chip package of claim 1, wherein the resin layer further includes an uneven portion on a surface thereof around the trench.

6. The flip chip package of claim 1, wherein the dam member is formed along a circumference of the mounting region.

7. The flip chip package of claim 1, further comprising a bump formed on the connection pad and electrically connected with the electronic device.

8. The flip chip package of claim 1, further comprising the underfill interposed between the electronic device and the board.

9. A flip chip package comprising:

an electronic device;

a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region;

a resin layer formed on the board and including an uneven portion at a part of a surface of the resin layer; and

a dam member provided on the uneven portion and preventing leakage of an underfill between the mounting region and the connection pad.

10. The flip chip package of claim 9, wherein the uneven portion is formed by coining the resin layer.

11. The flip chip package of claim 9, wherein the uneven portion is formed by exposing and developing the resin layer.

12. The flip chip package of claim 11, wherein the resin layer is formed of a photoresist resin.

13. The flip chip package of claim 9, wherein the dam member is formed along a circumference of the mounting region.

14. The flip chip package of claim 9, further comprising a bump formed on the connection pad and electrically connected with the electronic device.

15. The flip chip package of claim 9, further comprising the underfill interposed between the electronic device and the board.