Processing condition determining method and apparatus, display method and apparatus, processing apparatus, measurement apparatus and exposure apparatus, substrate processing system, and program and information recording medium

• US 8,566,756 B2
• Filed: 07/29/2008
• Issued: 10/22/2013
• Est. Priority Date: 01/30/2006
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Okita, Shinichi
• Primary Examiner(s): Rossoshek, Helen
• Application Number:
  US12/181,705
• Publication Number:
  US 20080294280A1
• Time in Patent Office: 1,911 Days
• Field of Search: 716 50- 55, 430/5, 430/30, 355/53, 355/55, 355/71
• US Class Current: 716/54
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 9/7046 Strategy, e.g. mark, sensor or wavelength selection
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/32018 Adapt process as function of results of quality measuring until maximum quality
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 21/823475 interconnection or wiring or contact manufacturing related aspects
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

In a first process, a process A, an actually measured transfer position measured by a measurement/inspection instrument is indicated by a black circle. A targeted transfer position indicated by x in a process B is located at the same position as the black circle. Assuming that the weights in the subsequent processes are the same, a targeted transfer position X_target indicated by x in processes C, D and E is located at a moderate position with which the total deviation from an actual transfer position (black circle) measured by the measurement/inspection instrument in a process preceding the current process is minimized, that is, at a proper position with respect to a plurality of other processes. Accordingly, the productivity of devices can be improved.

Claims

1. A processing condition determining method comprising:

a determination process of determining, using an information processor, a processing condition for a pattern of a layer to be formed on an object during a lithography exposure process;

a measurement process of measuring at least one of occurrence frequency of overlay error and linewidth error between a target linewidth and a measured linewidth of a pattern that has been formed on the object according to the processing condition determined in the determination process; and

a process of obtaining frequency at which the determination process and the measurement process are performed, in accordance with the at least one of occurrence frequency of overlay error and linewidth error between a target linewidth and a measured linewidth of the pattern measured in the measurement process;

wherein the processing condition is determined based on information on a forming state of a pattern previously formed on at least one of

a plurality of layers that have been already formed on the object, and

a plurality of layers that have already been formed on another object.

2. The processing condition determining method according to claim 1, wherein

when the processing condition is determined, at least one of overlay deviation and linewidth deviation of each layer of a plurality of layers is weighted.

3. The processing condition determining method according to claim 2, wherein

in accordance with relevance with a device pattern layer for which the processing condition is determined, a weight of each layer of a plurality of layers is determined.

4. The processing condition determining method according to claim 2, wherein

a weight of the each layer is determined taking thickness of the layer into consideration.

5. The processing condition determining method according to claim 2, wherein

information on the weight of the each layer is input in the information processor via a man-machine interface.

6. The processing condition determining method according to claim 1, wherein

the exposure process includes forming the pattern by transfer on the object, and

the processing condition includes a condition related to alignment of the pattern and the object in the exposure process.

7. The processing condition determining method according to claim 6, wherein

the condition related to alignment includes a condition related to a targeted transfer position of the pattern.

8. The processing condition determining method according to claim 1, wherein

the exposure process forms the pattern by transfer on the object, and

the processing condition includes a transfer condition of the pattern in the exposure process.

9. The processing condition determining method according to claim 8, wherein the transfer condition includes at least one of

a condition related to energy of an energy beam used to transfer the pattern onto the object, a condition related to focus of an optical system that projects the pattern on the object, a condition related to synchronous control of a stage on which the pattern is mounted and a stage on which the object is mounted, and a condition related to relative positional deviation between the pattern and the object.

10. The processing condition determining method according to claim 1, wherein

the processing condition includes information on a permissible value of at least one of overlay deviation and linewidth deviation of a pattern of a layer that is subject to the exposure process.

11. The processing condition determining method according to claim 10, wherein

the information on a forming state of a pattern includes at least one of information on overlay of a pattern relating to a plurality of layers, and information on linewidth of the pattern relating to a plurality of layers, and

the information on a permissible value of at least one of overlay deviation and linewidth deviation is determined, at least taking into consideration information on deviation relating to a plurality of layers of at least one of the information on overlay and the information on linewidth.

12. The processing condition determining method according to claim 1, wherein

in the case where the determined processing condition is different from a default processing condition, the information processor displays the determined processing condition via a man-machine interface.

13. The processing condition determining method according to claim 12, wherein

the determined processing condition is displayed together with the default processing condition.

14. A processing condition determining apparatus that determines a processing condition with respect to a pattern that is formed and layered on an object, using the processing condition determining method according to claim 1.

15. A processing apparatus that executes a process of forming a pattern on an object, the apparatus comprising:

the processing condition determining apparatus according to claim 14.

16. A measurement apparatus that measures information on a pattern formed on an object, the apparatus comprising:

the processing condition determining apparatus according to claim 14.

17. An exposure apparatus that transfers a pattern onto an object, the apparatus comprising:

the processing condition determining apparatus according to claim 14.

18. A substrate processing system comprising:

a determination section that determines a processing condition of a pattern to be formed on an object during a lithography exposure process;

a measurement section that measures at least one of occurrence frequency of overlay error and linewidth error between a target linewidth and a measured linewidth of a pattern that has been formed on the object according to the processing condition determined by the determination section; and

a processing section that obtains frequency at which the determination section determines and the measurement section measures, in accordance with the at least one of occurrence frequency of overlay error and linewidth error between a target linewidth and a measured linewidth of the pattern measured by the measurement section;

wherein the processing condition is determined based on information on a forming state of a pattern previously formed on at least one of

a plurality of layers that have been already formed on the object, and

a plurality of layers that have already been formed on another object.

19. A non-transitory computer-readable medium storing thereon a program that, when executed by a computer, causes the computer to perform:

a determination process of determining a processing condition for a pattern of a layer to be formed on an object during a lithography exposure process;

a measurement process of measuring at least one of occurrence frequency of overlay error and linewidth error between a target linewidth and a measured linewidth of a pattern that has been formed on the object according to the processing condition determined in the determination process; and

a process of obtaining frequency at which the determination process and the measurement process are performed, in accordance with the at least one of occurrence frequency of overlay error and linewidth error between a target linewidth and a measured linewidth of the pattern measured in the measurement process;

wherein the processing condition is determined based on information on a forming state of a pattern previously formed on at least one of

a plurality of layers that have been already formed on the object, and

a plurality of layers that have already been formed on another object.

20. The non-transitory computer-readable medium according to claim 19, wherein

when the processing condition is determined, at least one of overlay deviation and linewidth deviation of each layer of a plurality of layers is weighted.

21. The non-transitory computer-readable medium according to claim 20, wherein, in accordance with relevance with a device pattern layer for which the processing condition is determined, the program, when executed by the computer, causes the computer to perform:

determining a weight of each layer of a plurality of layers.

22. The non-transitory computer-readable medium according to claim 20, wherein

a weight of the each layer is determined taking thickness of the layer into consideration.

23. The non-transitory computer-readable medium according to claim 20, wherein the program, when executed by the computer, causes the computer to further perform:

a process of inputting information on the weight of the each layer via a man-machine interface.

24. The non-transitory computer-readable medium according to claim 19, wherein

the exposure process forms the pattern by transfer on the object, and

the processing condition includes a condition related to alignment of a pattern of a layer that is subject to processing and the object.

25. The non-transitory computer-readable medium according to claim 24, wherein

the condition related to alignment includes a condition related to a targeted transfer position of the pattern.

26. The non-transitory computer-readable medium according to claim 19, wherein

the exposure process forms the pattern by transfer on the object, and

the processing condition includes a transfer condition of a pattern of a layer that is subject to processing.

27. The non-transitory computer-readable medium according to claim 26, wherein the transfer condition includes at least one of

a condition related to energy of an energy beam used to transfer the pattern onto the object, a condition related to focus of an optical system that projects the pattern on the object, a condition related to synchronous control of a stage on which the pattern is mounted and a stage on which the object is mounted, and a condition related to relative positional deviation between the pattern and the object.

28. The non-transitory computer-readable medium according to claim 19, wherein

the processing condition includes information on a permissible value of at least one of overlay deviation and linewidth deviation of a pattern of a layer that is subject to processing.

29. The non-transitory computer-readable medium according to claim 28, wherein

the information on a forming state of a pattern includes at least one of information on overlay of a pattern relating to a plurality of layers, and information on linewidth of the pattern relating to a plurality of layers, and

the information on a permissible value of at least one of overlay deviation and linewidth deviation is determined, at least taking into consideration information on deviation relating to a plurality of layers of at least one of the information on overlay and the information on linewidth.

30. The non-transitory computer-readable medium according to claim 19, wherein, in the case where the determined processing condition is different from a default processing condition, the program, when executed by the computer, causes the computer to perform:

displaying the determined processing condition via a man-machine interface.

31. The non-transitory computer-readable medium according to claim 30, wherein

the determined processing condition is displayed together with the default processing condition.

32. The non-transitory computer-readable medium according to claim 19, wherein

at least a part of the object on which the abnormality has been detected in the detection process is excluded from a subsequent processing subject in a predetermined unit of processing.

33. A method comprising:

a determination process of determining, using an information processor, a processing condition for a pattern of a layer to be formed on an object during a lithography exposure process, the processing condition being determined based on information on a forming state of a pattern previously formed on at least one of

a plurality of layers that have been already formed on the object, and

a plurality of layers that have already been formed on another object;

a measurement process of measuring at least one of overlay error and linewidth error of a pattern that has been formed on the object according to the processing condition determined in the determination process;

a process of obtaining frequency at which the determination process and the measurement process are performed, in accordance with the at least one of overlay error and linewidth error measured in the measurement process; and

a detection process of detecting, based on a comparison of a measurement result of the measurement process and a threshold value, at least one of overlay abnormality and linewidth abnormality of a pattern of the layer that is subject to processing;

wherein the determination process is performed only in the case where said at least one of overlay abnormality and linewidth abnormality has been detected by the detection process.

34. The method according to claim 33, wherein,

when the at least one of overlay abnormality and linewidth abnormality of the pattern of the layer that is subject to processing is detected in the detection process, at least part of the layer is excluded from a subsequent processing subject in a predetermined unit of processing.

35. The method according to claim 33, wherein

in accordance with occurrence frequency of the at least one of overlay abnormality and linewidth abnormality detected in the detection process, a number of times of inspection of defect is increased or decreased.

36. A non-transitory computer readable medium storing thereon a computer program that, when executed by a computer, causes the computer to perform:

a determination process of determining, using an information processor, a processing condition for a pattern of a layer to be formed on an object during a lithography exposure process, the processing condition being determined based on information on a forming state of a pattern previously formed on at least one of

a plurality of layers that have been already formed on the object, and

a plurality of layers that have already been formed on another object;

a measurement process of measuring at least one of overlay error and linewidth error of a pattern that has been formed on the object according to the processing condition determined in the determination process;

a process of obtaining frequency at which the determination process and the measurement process are performed, in accordance with the at least one of overlay error and linewidth error measured in the measurement process; and

a detection process of detecting, based on a comparison of a measurement result of the measurement process and a threshold value, at least one of overlay abnormality and linewidth abnormality of a pattern of the layer that is subject to processing;

wherein the determination process is performed only in the case where said at least one of overlay abnormality and linewidth abnormality has been detected by the detection process.