Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame

• US 8,569,785 B2
• Filed: 04/04/2007
• Issued: 10/29/2013
• Est. Priority Date: 08/24/2001
• Status: Active Grant

• Current Assignee: Satco Products Incorporated
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Jackson, Jr., Jerome
• Application Number:
  US12/296,274
• Publication Number:
  US 20100096643A1
• Time in Patent Office: 2,400 Days
• Field of Search: 257/88, 257/99
• US Class Current: 257/99
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present invention is a semiconductor light source 100 for illuminating physical spaces including a lead frame with multiple facets 101. Each facet can have one or more semiconductor light emitting devices 108, such as LEDs, located on it. The light source is disclosed in threaded 100, surface mounted 400, and bar light 700 configurations.

Claims

1. A semiconductor light source for illuminating a physical space comprising a lead frame having at least two electrodes, one being a cathode and another being an anode, the lead frame further comprising:

a. a cylindrical electrode, made of a heat conductive material, having a closed first end upon which an electrical connection is attached,

b. a second electrode, insertable within the cylindrical electrode, said second electrode having an upper portion with a diameter sufficient to prevent full insertion into the cylindrical electrode and an electrical connection;

c. electrical insulation between the cylindrical electrode and said second electrode, thereby electrically isolating said cylindrical electrode from said second electrode;

d. a plurality of facets located on said cylindrical electrode, said facets being configured to accept mounting of light emitting semiconductor chips thereon; and

e. a plurality of light emitting semiconductor chips mounted on said facets of said cylindrical electrode and connected electrically to said cylindrical electrode and said second electrode.

2. A semi-conductor light source as recited in claim 1 wherein said cylindrical electrode and said second electrode are configured with respect to each other to form a bar light.

3. A semi-conductor light source as recited in claim 2 further comprising an encapsulation structure over said bar light.

4. A semi-conductor light source as recited in claim 1 further comprising at least one other lead frame with a plurality of facets in operable connection to the lead frame and having at least one LED chip on at least one facet.