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Reactive sputtering chamber with gas distribution tubes

  • US 8,574,411 B2
  • Filed: 10/10/2011
  • Issued: 11/05/2013
  • Est. Priority Date: 04/06/2006
  • Status: Active Grant
First Claim
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1. A Plasma Vapor Deposition apparatus for depositing a layer on a substrate, comprising:

  • a vacuum chamber;

    a substrate support positioned in the vacuum chamber; and

    a plurality of gas introduction tubes extending across an internal volume of the vacuum chamber, the gas introduction tubes comprising;

    a first inner tube having a plurality of first openings extending along a first center axis, the first openings occupying a first plurality of different angular positions on a circumference of the first inner tube, wherein the first plurality of different angular positions are defined with respect to the first center axis that extends along a flow direction of the first inner tube;

    an outer tube surrounding the first inner tube and having a plurality of second openings extending along the first center axis which do not align with the first openings, the second openings occupying a second plurality of different angular positions on a circumference of the outer tube, wherein the second plurality of different angular positions are defined with respect to the first center axis; and

    a second inner tube having a plurality of third openings extending along the first center axis which do not align with the first openings, the first inner tube surrounding the second inner tube.

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