Combined diode, lead assembly incorporating an expansion joint

• US 8,586,857 B2
• Filed: 11/04/2008
• Issued: 11/19/2013
• Est. Priority Date: 11/04/2008
• Status: Active Grant

• Current Assignee: Beijing Apollo Ding Rong Solar Technology Co., Ltd
• Original Assignee: MiaSole Incorporated (Wei Jun Li)
• Inventors: Everson, Shawn, Croft, Steven T., Halstead, Whitfield G., Corneille, Jason S.
• Primary Examiner(s): Mowla, Golam
• Application Number:
  US12/264,712
• Publication Number:
  US 20100108122A1
• Time in Patent Office: 1,841 Days
• Field of Search: 136/246, 136/244, 136/256, 136/293, 257/676, 257/692, 257/696, 257/712, 257/773, 257/779, 257/459, 257/443, 257/E23.023, 257/E23.043, 257/E23.047, 257/E23.051, 257/E23.101, 257/E23.07, 174/126.1, 174/137.R, 228/141.1, 228/179.1
• US Class Current: 136/246
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/29109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 24/33 of a plurality of layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H02S 40/34 : comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
• CPC Class Codes: H02S 40/345 : with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box cooling means for PV cells H01L31/052, for PV modules H02S40/42
• CPC Class Codes: Y02E 10/50 : Photovoltaic [PV] energy

Abstract

A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.

Claims

1. A lead incorporating an expansion joint, said lead comprising:

a conductor comprising;

a first terminal, said first terminal of said conductor configured to electrically couple to an electrical device; and

a second terminal, said second terminal of said conductor configured as said expansion joint, said expansion joint configured to electrically couple to an interconnecting-conductor and configured to reduce a stress applied to said electrical device, wherein said expansion joint is electrically connected to the interconnecting-conductor without requiring any other material disposed between them.

2. The lead incorporating the expansion joint of claim 1, wherein said expansion joint is configured to protect said electrical device from application of a stress to said electrical device sufficient to fracture said electrical device.

3. The lead incorporating the expansion joint of claim 1, wherein said expansion joint is configured to provide a sliding contact in communication with said interconnecting-conductor.

4. The lead incorporating the expansion joint of claim 1, wherein said expansion joint is configured as a portion of a lap joint.

5. The lead incorporating the expansion joint of claim 1, wherein said expansion joint of said conductor further comprises:

a planar strip portion, said planar strip portion having a first planar surface and a second planar surface substantially parallel to said first planar surface;

wherein at least one of said first and second planar surfaces is configured to provide a sliding contact in communication with said interconnecting-conductor.

6. The lead incorporating the expansion joint of claim 5, wherein said first terminal of said conductor further comprises:

a pocket portion configured to accept and to electrically couple to said electrical device, said pocket portion offset from at least one of said first and second planar surfaces;

wherein said pocket portion is configured to reduce a bending load applied to said electrical device.

7. The lead incorporating the expansion joint of claim 1, wherein said first terminal of said conductor further comprises:

a tab portion configured to electrically couple to said electrical device;

wherein said tab portion is configured to reduce a bending load applied to said electrical device.

8. The lead incorporating the expansion joint of claim 1, wherein said first terminal of said conductor further comprises:

a recessed portion configured to control an outflow of solder from within a solder joint formed between a terminal of said electrical device and said first terminal of said conductor.

19. A combined electrical device, lead assembly incorporating an expansion joint, said combined electrical device, lead assembly comprising:

an electrical device; and

a plurality of leads coupled to said electrical device, at least one lead of said plurality of conductors as in claim 1.

20. The combined electrical device, lead assembly incorporating an expansion joint of claim 19, wherein said electrical device is selected from the group consisting of a semiconductor device, a diode, a transistor, a battery, an inverter and a DC-to-DC converter.

21. A solar-cell module comprising:

a plurality of solar-cells electrically coupled together; and

an in-laminate-diode assembly electrically coupled with said plurality of solar cells, said in-laminate-diode assembly configured to prevent power loss;

said in-laminate-diode assembly further comprising at least one in-laminate-diode sub-assembly, said in-laminate-diode sub-assembly comprising a combined diode, lead assembly incorporating an expansion joint, said combined diode, lead assembly incorporating said expansion joint comprising;

a diode; and

a plurality of a first lead and a second lead electrically coupled to said diode in which at least one lead of said plurality is as in claim 1 and wherein the electrical device is the diode;

and wherein the expansion joint is electrically coupled to the interconnecting-conductor.

22. The solar-cell module of claim 21, wherein said solar-cell module further comprises at least one busbar;

and

wherein a busbar of said solar-cell module is configured as said interconnecting-conductor.

23. The solar-cell module of claim 21, wherein said solar-cell module further comprises at least one interconnect assembly;

and

wherein an interconnect assembly of said solar-cell module is configured as said interconnecting-conductor.

24. The solar-cell module of claim 21, wherein at least one of said first conductor, said second conductor and an interconnecting-conductor portion of said interconnecting-conductor of said in-laminate-diode sub-assembly is configured as a heat sink to remove heat generated by said diode.

25. The solar-cell module of claim 21, wherein said in-laminate-diode sub-assembly further comprises an electrically-insulating-laminate strip configured to allow access of at least one of said first conductor, said second conductor and said interconnecting-conductor to a solar cell of said plurality of solar cells for electrically coupling with said solar cell.

26. The solar-cell module of claim 25, wherein said electrically-insulating-laminate strip is configured with a cutting pattern that allows folding cut portions of said electrically-insulating-laminate strip over a side opposite to a side of at least one of said first conductor, said second conductor and said interconnecting-conductor that electrically couples with said solar cell.

27. The solar-cell module of claim 25, wherein said electrically-insulating-laminate strip further comprises a layer of adhesive on both a solar-cell-facing side and a side opposite said solar-cell-facing side of said electrically-insulating-laminate strip.

28. The solar-cell module of claim 21, wherein said in-laminate-diode assembly further comprises:

a first electrically-insulating-laminate strip comprising a plurality of via-hole cutouts, a via-hole cutout of said plurality of via-hole cutouts configured to allow access of at least one of said first conductor and said second conductor to a solar cell of said plurality of solar cells for electrically coupling with said solar cell; and

a second electrically-insulating-laminate strip comprising a plurality of complementary cutouts, a complementary cutout of said second plurality of complementary cutouts configured such that said complementary cutout is disposed in said second electrically-insulating-laminate strip at a site located between a first via-hole cutout and a second via-hole cutout of said first electrically-insulating-laminate strip when said second electrically-insulating-laminate strip overlays said first electrically-insulating-laminate strip.

29. The solar-cell module of claim 28, wherein said complementary cutout in said second electrically-insulating-laminate strip has a complementary shape to a first shape of said first via-hole cutout and a second shape of said second via-hole cutout of said first electrically-insulating-laminate strip, said complementary shape of said complementary cutout defined by and substantially congruent with a shape of a gap region lying between said first via-hole cutout and said second via-hole cutout of said first electrically-insulating-laminate strip.

30. The solar-cell module of claim 29, wherein said first via-hole cutout of said plurality of via-hole cutouts of said first electrically-insulating-laminate strip has a first substantially rectangular shape, and said second via-hole cutout of said plurality of via-hole cutouts of said first electrically-insulating-laminate strip has a second substantially rectangular shape, wherein said first via-hole cutout and said second via-hole cutout of said plurality of via-hole cutouts of said first electrically-insulating-laminate strip are separated by a gap region having a third substantially rectangular shape;

and

wherein said complementary cutout of said plurality of complementary cutouts of second electrically-insulating-laminate strip has a fourth substantially rectangular shape substantially congruent with said third substantially rectangular shape of said gap region.

31. The solar-cell module of claim 21, wherein said in-laminate-diode assembly further comprises:

a first electrically-insulating-laminate strip comprising a plurality of via-hole cutouts, a via-hole cutout of said plurality of via-hole cutouts configured to allow access of said first conductor to a solar cell of said plurality of solar cells for electrically coupling with said solar cell, said second conductor overlaying said first electrically-insulating-laminate strip; and

a plurality of interconnecting-conductors wherein said interconnecting-conductor comprises at least one interconnecting-conductor of said plurality of interconnecting-conductors, said plurality of interconnecting-conductors comprising at least a first interconnecting-conductor and a second interconnecting-conductor, said first interconnecting-conductor having at least a first interconnecting-conductor portion, said second interconnecting-conductor having at least a second interconnecting-conductor portion, said first interconnecting-conductor portion of said first interconnecting-conductor overlaying and electrically coupling with said first conductor, said second interconnecting-conductor portion of said second interconnecting-conductor overlaying and electrically coupling with said second conductor.

32. The solar-cell module of claim 31, wherein said in-laminate-diode assembly further comprises:

a second electrically-insulating-laminate strip overlaying said plurality of interconnecting-conductors, said second electrically-insulating-laminate strip comprising a plurality of complementary cutouts, a complementary cutout of said plurality of complementary cutouts configured to maintain a first combined thickness of said first electrically-insulating-laminate strip, said second interconnecting-conductor portion of said second interconnecting-conductor and said second conductor about equal to a second combined thickness of said second electrically-insulating-laminate strip, said first interconnecting-conductor portion of said first interconnecting-conductor and said first conductor.

33. The solar-cell module of claim 21, wherein said in-laminate-diode sub-assembly further comprises at least one of said first conductor, said second conductor and said interconnecting-conductor structured to enable a laminated electrical connection between at least one of respective said first conductor, said second conductor and said interconnecting-conductor and another component of said solar-cell module.

34. The solar-cell module of claim 21, wherein said in-laminate-diode sub-assembly comprises at least one diode configured to by-pass current flow around at least one solar cell to prevent power loss.

9. A combined diode, lead assembly incorporating two expansion joints, said combined diode, lead assembly comprising:

a diode having a first diode terminal and a second diode terminal;

a first conductor comprising;

a first terminal, said first terminal of said first conductor electrically coupled to said diode at said first diode terminal; and

a second terminal, said second terminal of said first conductor configured as a first expansion joint, said first expansion joint comprising a non-fixed connection configured to electrically couple to a first interconnecting-conductor and configured to reduce a stress applied to said diode; and

a second conductor comprising;

a first terminal, said first terminal of said second conductor electrically coupled to said second diode terminal; and

a second terminal, said second terminal of said second conductor configured as a second expansion joint, said second expansion joint configured to electrically couple to a second interconnecting-conductor and configured to reduce a stress applied to said diode, wherein said expansion joint is electrically connected to the interconnecting-conductor without requiring any other material disposed between them.

10. The combined diode, lead assembly incorporating the two expansion joints of claim 9 wherein said first and second expansion joints are configured to protect said diode from application of a stress to said diode sufficient to fracture said diode.

11. The combined diode, lead assembly incorporating the two expansion joints of claim 9 wherein said first expansion joint is configured to provide a sliding contact in communication with said first interconnecting-conductor, and wherein said second expansion joint is configured to provide a sliding contact in communication with said second interconnecting-conductor.

12. The combined diode, lead assembly incorporating the two expansion joints of claim 11 wherein said first expansion joint is configured as a portion of a first lap joint, and wherein said second expansion joint is configured as a portion of a second lap joint.

13. The combined diode, lead assembly incorporating the two expansion joints of claim 9 wherein said first expansion joint of said first conductor further comprises:

a first planar strip portion, said first planar strip portion having a first planar surface and a second planar surface substantially parallel to said first planar surface;

wherein at least one of said first and second planar surfaces of said first planar strip portion is configured to provide a sliding contact in communication with said first interconnecting-conductor.

14. The combined diode, lead assembly incorporating the two expansion joints of claim 13 wherein said first terminal of said first conductor further comprises:

a pocket portion electrically coupled to said diode at said first diode terminal, said pocket portion offset from at least one of said first and second planar surfaces;

wherein said pocket portion is configured to reduce a bending load applied to said diode.

15. The combined diode, lead assembly incorporating the two expansion joints of claim 9, wherein said second expansion joint of said second conductor further comprises:

a second planar strip portion, said second planar strip portion having a first planar surface and a second planar surface substantially parallel to said first planar surface;

wherein at least one of said first and second planar surfaces of said second planar strip portion is configured to provide a sliding contact in communication with said second interconnecting-conductor.

16. The combined diode, lead assembly incorporating the two expansion joints of claim 9, wherein said first terminal of said second conductor further comprises:

a tab portion electrically coupled to said diode at said second diode terminal;

wherein said tab portion is configured to reduce a bending load applied to said diode.

17. The combined diode, lead assembly incorporating the two expansion joints of claim 9, wherein said first terminal of said first conductor further comprises:

a first recessed portion configured to control an outflow of solder from within a first solder joint formed between said first diode terminal of said diode and said first terminal of said first conductor.

18. The combined diode, lead assembly incorporating the two expansion joints of claim 9, wherein said first terminal of said second conductor further comprises:

a second recessed portion configured to control an outflow of solder from within a second solder joint formed between said second diode terminal of said diode and said first terminal of said second conductor.

35. A combined diode, lead assembly incorporating an expansion joint and an integrated interconnecting-conductor, said combined diode, lead assembly comprising:

a diode having a first diode terminal and a second diode terminal;

a first conductor comprising;

a first terminal, said first terminal of said first conductor electrically coupled to said diode at said first diode terminal;

and

a second terminal, said second terminal of said first conductor configured as said integrated interconnecting-conductor; and

a second conductor comprising;

a first terminal, said first terminal of said second conductor electrically coupled to said diode at said second diode terminal; and

a second terminal, said second terminal of said second conductor configured as an expansion joint, said expansion joint configured to electrically couple to an interconnecting-conductor and configured to reduce a stress applied to said diode, wherein said expansion joint is electrically connected to the interconnecting-conductor without requiring any other material disposed between them.

36. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 35, wherein said expansion joint is configured to provide a sliding contact in communication with said interconnecting-conductor.

37. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 35, wherein said expansion joint is configured as a portion of a lap joint.

38. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 35, wherein said expansion joint of said second conductor further comprises:

a second planar strip portion, said second planar strip portion having a first planar surface and a second planar surface substantially parallel to said first planar surface;

wherein at least one of said first and second planar surfaces of said second planar strip portion is configured to provide a sliding contact in communication with said interconnecting-conductor.

39. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 38, wherein said first terminal of said second conductor further comprises:

a pocket portion electrically coupled to said diode at said second diode terminal, said pocket portion offset from at least one of said first and second planar surfaces;

wherein said pocket portion is configured to reduce a bending load applied to said diode.

40. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 39, wherein said first terminal of said first conductor further comprises:

a tab portion electrically coupled to said diode at said first diode terminal;

wherein said tab portion is configured to reduce a bending load applied to said diode.

41. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 40, wherein said first terminal of said first conductor further comprises:

a first planar strip portion, said first planar strip portion having a first planar surface and a second planar surface substantially parallel to said first planar surface; and

wherein said first terminal of said first conductor further comprises;

a pocket portion electrically coupled to said diode at said first diode terminal, said pocket portion offset from at least one of said first and second planar surfaces;

wherein said pocket portion is configured to reduce a bending load applied to said diode.

42. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 41, wherein said first terminal of said second conductor further comprises:

a tab portion electrically coupled to said diode at said second diode terminal;

wherein said tab portion is configured to reduce a bending load applied to said diode.

43. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 35, wherein said first terminal of said first conductor further comprises:

a first recessed portion configured to control an outflow of solder from within a first solder joint formed between said first diode terminal of said diode and said first terminal of said first conductor.

44. The combined diode, lead assembly incorporating the expansion joint and an integrated interconnecting-conductor of claim 35, wherein said first terminal of said second conductor further comprises:

a second recessed portion configured to control an outflow of solder from within a second solder joint formed between said second diode terminal of said diode and said first terminal of said second conductor.

45. A solar-cell module comprising:

a plurality of solar-cells electrically coupled together; and

an in-laminate-diode assembly electrically coupled with said plurality of solar cells, said in-laminate-diode assembly configured to prevent power loss;

said in-laminate-diode assembly further comprising at least a first in-laminate-diode sub-assembly, said first in-laminate-diode sub-assembly comprising at least the first combined diode, lead assembly incorporating the expansion joint and the integrated interconnecting-conductor as in claim 35.

46. The solar-cell module of claim 45, wherein said in-laminate-diode assembly further comprises a second in-laminate-diode sub-assembly, said second in-laminate-diode sub-assembly further comprising a second combined diode, lead assembly incorporating at least one expansion joint, said second combined diode, lead assembly comprising a second conductor comprising a second terminal, said second terminal of said second conductor of said second combined diode, lead assembly configured as an expansion joint of said second combined diode, lead assembly;

and

wherein said integrated interconnecting-conductor of said first combined diode, lead assembly is configured to electrically couple to said expansion joint of said second conductor of said second combined diode, lead assembly.

47. The solar-cell module of claim 46, wherein said expansion joint of said second combined diode, lead assembly is configured to provide a sliding contact in communication with said integrated interconnecting-conductor of said first combined diode, lead assembly.

48. The solar-cell module of claim 46, wherein said expansion joint of said second combined diode, lead assembly is configured as a portion of a lap joint between said expansion joint of said second combined diode, lead assembly and said integrated interconnecting-conductor of said first combined diode, lead assembly.