Laminated circuit board and board producing method

• US 8,586,876 B2
• Filed: 04/13/2011
• Issued: 11/19/2013
• Est. Priority Date: 06/09/2010
• Status: Active Grant

• Current Assignee: FICT Limited
• Original Assignee: Fujitsu Limited
• Inventors: Yoshimura, Hideaki
• Primary Examiner(s): Nguyen, Hoa C
• Assistant Examiner(s): Augustin, Christopher L
• Application Number:
  US13/085,804
• Publication Number:
  US 20110303454A1
• Time in Patent Office: 951 Days
• Field of Search: 174/264, 174/262, 174/265, 174/266, 174/263, 174250-260
• US Class Current: 174/264
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking.

Claims

1. A laminated circuit board comprising:

a first wiring board that has a first land formed on a surface thereof;

a second wiring board that has a second land formed on a surface thereof;

a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; and

a plate that has a through-hole into which the conducting material is supplied, wherein

the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking, the resin accommodating space having a total volume equal to a volume calculated using a residual copper ratios of wiring surfaces of the first and the second wiring boards.

2. The laminated circuit board according to claim 1, wherein the resin accommodating space is a through-hole.

3. The laminated circuit board according to claim 1, wherein the bonding layer is formed on each of the front surface and the rear surface of the plate in advance.

4. The laminated circuit board according to claim 2, wherein the bonding layer is formed on each of the front surface and the rear surface of the plate in advance.

5. The laminated circuit board according to claim 3, wherein a bonding surface of the bonding layer that is formed on each of the front surface and the rear surface of the plate is covered with a protective film.

6. The laminated circuit board according to claim 3, wherein a bonding layer that is formed on either the front surface or the rear surface of the plate has a through-hole that accommodates therein the excess bonding resin but the other bonding layer does not.

7. The laminated circuit board according to claim 4, wherein a bonding layer that is formed on either the front surface or the rear surface of the plate has a through-hole that accommodates therein the excess bonding resin but the other bonding layer does not.

8. The laminated circuit board according to claim 1, wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.

9. The laminated circuit board according to claim 2, wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.

10. The laminated circuit board according to claim 3, wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.

11. The laminated circuit board according to claim 4, wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.

12. The laminated circuit board according to claim 5, wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.

13. A method of producing a laminated circuit board, the method comprising:

forming bonding layers on bonding surfaces of a first wiring board and a second wiring board, wherein the first wiring board has a first land formed on the surface thereof, the second wiring board has a second land formed on the surface thereof, and the bonding layers electrically connect the first land and the second land via a conducting material;

forming a through-hole on the bonding layers to accommodate the conducting material;

filling the through-hole with the conducting material;

aligning a plate to a bonding plane where the first wiring board and the second wiring board are bonded together, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking, the resin accommodating space having a total volume equal to a volume calculated using a residual copper ratios of wiring surfaces of the first and the second wiring boards; and

applying heat under pressure to perform the layer stacking, wherein the pressure is in a direction perpendicular to the plate position-decided at the deciding and layers of the first wiring board and the second wiring board.