Integrated circuit including sensor having injection molded magnetic material

• US 8,587,297 B2
• Filed: 12/04/2007
• Issued: 11/19/2013
• Est. Priority Date: 12/04/2007
• Status: Expired due to Fees

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Ausserlechner, Udo
• Primary Examiner(s): Hollington, Jermele M
• Assistant Examiner(s): Schindler, David M.
• Application Number:
  US11/950,050
• Publication Number:
  US 20090140725A1
• Time in Patent Office: 2,177 Days
• Field of Search: 324/174, 324/207.2, 324/207.21, 324/249, 324/251, 324/252
• US Class Current: 324/251
• CPC Class Codes: G01R 33/072 Constructional adaptation of the sensor to specific applications
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10N 50/00 Galvanomagnetic devices Hall-effect devices H10N52/00; integrated devices or assemblies of multiple devices H10N59/00
• CPC Class Codes: H10N 50/01 Manufacture or treatment
• CPC Class Codes: H10N 50/80 Constructional details
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49158 with molding of insulated base

Abstract

An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.

Claims

1. An integrated circuit comprising:

a magnetic field sensor comprising a die including a magnetic field sensitive element;

a bond wire electrically coupled to the die; and

an injection molded magnetic material directly contacting the bond wire, enclosing at least a portion of the magnetic field sensor and directly contacting at least a portion of the die,

wherein the injection molded magnetic material comprises;

first injection molded magnetic material having a first thickness on a first side of the magnetic field sensor; and

second injection molded magnetic material having a second thickness greater than the first thickness, the second injection molded magnetic material on a second side of the magnetic field sensor opposite the first side,

wherein the first injection molded magnetic material is opposite the second injection molded magnetic material,

wherein the first injection molded magnetic material has a first remanence,

wherein the second injection molded magnetic material has a second remanence less than the first remanence, and

wherein the thickness of the first injection molded magnetic material times the first remanence equals the thickness of the second injection molded magnetic material times the second remanence.

2. The integrated circuit of claim 1, wherein the magnetic field sensor comprises:

a leadframe,

wherein the die is coupled to the leadframe via the bond wire.

3. The integrated circuit of claim 1, further comprising:

an injection molded plastic material enclosing at least a portion of the magnetic field sensor.

4. The integrated circuit of claim 3, wherein the injection molded plastic material is on the first side of the magnetic field sensor.

5. The integrated circuit of claim 3, wherein the injection molded plastic material encloses the magnetic field sensor, and

wherein the injection molded magnetic material is coupled to at least a portion of the injection molded plastic material.

6. The integrated circuit of claim 5, wherein the injection molded magnetic material is one of mechanically coupled and chemically coupled to the injection molded plastic material.

7. An integrated circuit comprising:

a magnetic field sensor comprising a die including a magnetic field sensitive element;

a bond wire electrically coupled to the die; and

an injection molded magnetic material directly contacting the bond wire, enclosing at least a portion of the magnetic field sensor and directly contacting at least a portion of the die,

wherein the injection molded magnetic material comprises;

first injection molded magnetic material having a first thickness on a first side of the magnetic field sensor; and

second injection molded magnetic material having a second thickness greater than the first thickness, the second injection molded magnetic material on a second side of the magnetic field sensor opposite the first side,

wherein the first injection molded magnetic material is opposite the second injection molded magnetic material,

wherein the second injection molded magnetic material includes a recessed portion centered with the die and configured to reduce a magnetic field component parallel to the die such that the magnetic field sensitive element is not saturated, and

wherein at least three sidewalls of the recessed portion are defined by the second injection molded magnetic material.

8. A system comprising:

a magnetic field sensor; and

a controller coupled to the magnetic field sensor,

wherein the magnetic field sensor comprises;

a leadframe;

a die including a magnetic field sensitive element, the die coupled to a front side of the leadframe;

a magnetic material injection molded directly over a back side of the leadframe such that the magnetic material forms a first plastic bonded magnet directly contacting the leadframe opposite the die; and

magnetic material injection molded over the die to form a second plastic bonded magnet directly contacting the die.

9. The system of claim 8, wherein the magnetic field sensitive element comprises one of a hall sensor element and a magneto-resistive element.

10. A sensor comprising:

a leadframe;

a die including magnetic field sensitive elements, the die coupled to a front side of the leadframe;

pins;

bond wires electrically coupling the die to the pins;

a first magnetic material injection molded directly on a back side of the leadframe such that the first magnetic material forms a plastic bonded magnet directly contacting the leadframe opposite the die; and

a second magnetic material injection molded directly on the die,

wherein the second magnetic material has a remanence greater than a remanence of the first magnetic material.

11. The system of claim 10, wherein the magnetic field sensitive element comprises one of a hall sensor element and a magneto-resistive sensor elements.

12. A method for fabricating an integrated circuit, the method comprising:

providing a magnetic field sensor comprising a die including magnetic field sensitive elements; and

injection molding magnetic material directly on the magnetic field sensitive elements,H

wherein the injection molding magnetic material comprises;

injection molding a first magnetic material having a first remanence over a first side of the magnetic field sensor; and

injection molding a second magnetic material having a second remanence less than the first remanence over a second side of the magnetic field sensor opposite the first side.