Lightweight audio system for automotive applications and method

• US 8,593,821 B2
• Filed: 08/12/2011
• Issued: 11/26/2013
• Est. Priority Date: 08/18/2006
• Status: Expired due to Fees

• Current Assignee: Aptiv Technologies Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Gupta, Vineet, Huntzinger, Joseph K., Coady, Michael G., Stapert, Curtis Allen, Meyer, Kevin Earl, Garner, Timothy D., Bell, Jeffrey T., Vadas, Robert L., Oberlin, Allen E.
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US13/208,746
• Publication Number:
  US 20110299251A1
• Time in Patent Office: 837 Days
• Field of Search: 361/752, 361/697, 361/704, 361/719, 361/720, 257/718, 165/185
• US Class Current: 361/752
• CPC Class Codes: B29C 59/16 by wave energy or particle radiation , e.g. infrared heating B29C59/007 takes precedence
• CPC Class Codes: B60R 11/02 for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
• CPC Class Codes: G06F 11/00 Error detection; Error correction; Monitoring error detection, correction or monitoring in information storage based on relative movement between record carrier and transducer G11B20/18; monitoring, i.e. supervising the progress of recording or reproducing G11B27/36; in static stores G11C29/00
• CPC Class Codes: H04B 1/082 to be used in vehicles H04B1/086 takes precedence; holding or mounting accessories B60R11/02
• CPC Class Codes: H04R 1/02 Casings; Cabinets ; Supports therefor; Mountings therein H04R1/28 takes precedence ; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0221 Locks; Latches
• CPC Class Codes: H05K 5/0226 Hinges
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein
• CPC Class Codes: H05K 9/0079 Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
• CPC Class Codes: H05K 9/0081 : Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material
• CPC Class Codes: Y10T 29/4957 : Sound device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49861 : Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 403/70 : Interfitted members
• CPC Class Codes: Y10T 428/24289 : Embedded or interlocked
• CPC Class Codes: Y10T 74/20396 : Hand operated

Abstract

A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Claims

1. A guillotine heat sink for an automotive audio system comprising:

a heat sink structure defining opposed generally parallel guide surfaces;

an audio system housing assembly including a case and a front closure member, said case having wall portions defining opposed cooperating guide slots within a cavity formed thereby, said guide slots configured for slidably receiving said heat sink; and

at least one electrical assembly including a heat generating component disposed within said cavity in register with said guide slots wherein a leading contact surface of said heat sink abuts an exposed surface of said component to establish a thermally conductive path therebetween,

wherein said housing assembly is formed of a composite of relatively rigid polymer material and electrically conductive material operable to shield said at least one electrical assembly from electrical anomalies including RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection), and ESD (electrostatic discharge), and

wherein said electrically conductive material comprises a wire screen insert molded within said polymer material and extending substantially continuously along the wall portions of said case and said front closure member.

2. The guillotine heat sink of claim 1, further comprising means operative to continuously urge said heat sink structure into contact with said component.

3. The guillotine heat sink of claim 2, wherein said means for urging the heat sink structure into contact with said component comprises a spring.

4. The guillotine heat sink of claim 3, wherein said spring is integrally formed with said housing assembly.

5. The guillotine heat sink of claim 3, wherein said spring is integrally formed with said heat sink structure.

6. The guillotine heat sink of claim 1, further comprising thermally coupling means, such as a silpad, intermediate said leading contact surface of said heat sink structure and said component.

7. The guillotine heat sink of claim 1, wherein said heat sink structure is configured to simultaneously abut a plurality of heat generating components.

8. The guillotine heat sink of claim 1, wherein said component is mounted upon a carrier, such as a PCB or substrate, within said cavity, and said housing assembly defines an underlying support pillar abutting a lower surface of said carrier in register with heat generating component.

9. The guillotine heat sink of claim 1, wherein said guide slots are defined by features integrally formed on the inner surfaces of an opposed pair of walls of said housing assembly.

10. The guillotine heat sink of claim 1, wherein said heat sink structure comprises a substantially flat plate formed of thermally conductive material, such as aluminum.

11. The guillotine heat sink of claim 10, wherein said heat sink structure further comprises a plurality of fins integrally formed with said plate.

12. The guillotine heat sink of claim 10, wherein said heat sink structure defines at least one wall of said housing assembly.