Method for forming microscopic 3D structures

• US 8,597,565 B2
• Filed: 03/31/2010
• Issued: 12/03/2013
• Est. Priority Date: 04/02/2009
• Status: Active Grant

• Current Assignee: FEI Company (Thermo Fisher Scientific Incorporated)
• Original Assignee: FEI Company (Thermo Fisher Scientific Incorporated)
• Inventors: Faber, Jacob Simon, Mulders, Johannes Jacobus Lambertus, de Jong, Alan Frank, van Vilsteren, Carmen Francisca Maria
• Primary Examiner(s): Tentoni, Leo B
• Application Number:
  US12/751,727
• Publication Number:
  US 20100255213A1
• Time in Patent Office: 1,343 Days
• Field of Search: 264/28, 264/81, 264/255, 264/334, 264/401, 264/485, 264/488
• US Class Current: 264/401
• CPC Class Codes: B29C 2035/0827 using UV radiation
• CPC Class Codes: B29C 2035/0833 using actinic light
• CPC Class Codes: B29C 2035/0844 using X-ray
• CPC Class Codes: B29C 2035/0877 using electron radiation, e.g. beta-rays
• CPC Class Codes: B29C 64/135 the energy source being concentrated, e.g. scanning lasers or focused light sources
• CPC Class Codes: B29C 64/188 involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00
• CPC Class Codes: B29K 2105/0076 Microcapsules
• CPC Class Codes: B29K 2105/165 Hollow fillers, e.g. microballoons or expanded particles
• CPC Class Codes: B29L 2023/005 Hoses, i.e. flexible
• CPC Class Codes: B29L 2031/756 Microarticles, nanoarticles
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: H01J 2237/31732 Depositing thin layers on selected microareas ion plating H01J2237/3142
• CPC Class Codes: H01J 2237/31749 Focused ion beam
• CPC Class Codes: H01J 37/3056 for microworking, e.g. etching of gratings, trimming of electrical components trimming of resistors H01C17/22
• CPC Class Codes: H01J 37/3174 Particle-beam lithography, e.g. electron beam lithography
• CPC Class Codes: H01J 37/3178 for applying thin layers on objects

Abstract

A method for forming microscopic 3D structures. In the method according to the invention a substrate (105) is placed in a Scanning Electron Microscope (SEM). The SEM is equipped with a Gas Injection System (GIS) (110) for directing a jet of precursor fluid to the substrate. The substrate is cooled below the freezing point of the precursor gas so that a frozen layer of the precursor gas can be applied to the substrate. By now repeatedly applying a frozen layer of the precursor to the substrate and irradiate the frozen layer with an electron beam (102), a stack of frozen layers (130) is built, each layer showing an irradiated part (131) in which the precursor is converted to another material. After applying the last layer the temperature is raised so that the unprocessed precursor (132) can evaporate. As a result 3D structures with overhanging features can be built.

Claims

1. A method for forming a structure on a substrate, the method comprising:

providing a substrate, said substrate showing a surface on which the structure is built;

repeatedly performing the steps of;

a) adding a thin layer of a fluid precursor material with a predetermined thickness on the surface, the fluid precursor material forming a solid or liquid layer on the surface, the layer defining a new surface;

b) converting part, but not all, of the precursor material to another material or to another physical state by irradiating part of the layer with particles, while the unconverted part of the precursor material stays unconverted on the surface;

the repeatedly performed steps of a) and b) followed by;

c) the removal of part, but not all, of the precursor material;

the penetration depth of the particles sufficient to convert the precursor material over the complete thickness of one layer, the penetration depth of the particles insufficient to convert the precursor material that, immediately prior to step c), is closest to the substrate,

as a result of which a structure is built in which, prior to step c), unconverted precursor material is sandwiched between the substrate and converted precursor material,

wherein;

steps a) and b) are performed in a vacuum, and

the thin layer is formed by directing a jet of fluid to the substrate.

2. The method of claim 1 in which the particles are charged particles.

3. The method of claim 1 in which the particles are photons.

4. The method of claim 1 in which the material removed in step c) is irradiated precursor material.

5. The method of claim 1 in which the material removed in step c) is non-irradiated precursor material.

6. The method of claim 1 in which during steps a) and b) the temperature of the substrate is kept below the freezing point of the precursor material, as a result of which step a) results in the formation of a frozen layer.

7. The method of claim 1 in which step c) takes the form of evaporating or sublimating material.

8. The method of claim 1 in which the particles are focused in a pencil beam that is scanned over the substrate in a predetermined pattern.

9. The method of claim 1 in which the particles form a pattern on the layer in the form of an image of a projection mask, said pattern imaged on the substrate with a projection lens.

10. The method of claim 1 in which the particles form a pattern on the layer in the form of a proximity mask, the thin layer positioned between the substrate and the proximity mask.

11. The method of claim 1 in which for the repeated applications of a precursor in step a) the same precursor is used.

12. The method of claim 1 in which for the repeated applications of the precursor in step a) at least two different precursors are used.

13. The method of claim 1 in which the precursor material comprises a metal atom.

14. The method of claim 1 in which the thin layer of precursor material comprises at least two types of molecules that, when irradiated, chemically react with each other.

15. A method for forming a structure on a substrate, the method comprising;

placing the substrate in a vacuum chamber;

forming a structure by;

(a) directing a jet of precursor fluid at the surface of the substrate to form solid or liquid layer of precursor material having a predetermined thickness on the surface, the precursor material reacting in the presence of the particle beam to form a desired solid material that is used to form a structure on the substrate;

(b) irradiating a part, but not all, of the precursor material layer with a particle beam, the irradiated part of the precursor material converting in the presence of the particle beam into the desired solid material, the particle beam having sufficient energy to cause the reaction of precursor material for the complete predetermined thickness of the layer, and not irradiating the remaining part of the precursor material layer with the particle beam;

(c) directing a jet of precursor fluid at the surface of the substrate to form an additional solid or liquid layer of precursor material having a predetermined thickness on the surface, said additional layer formed on top of the irradiated and non-irradiated parts of the previous layer;

(d) irradiating a part, but not all, of the additional precursor material layer with a particle beam, the precursor material converting in the presence of the particle beam into the desired solid material, the particle beam having sufficient energy to cause the reaction of precursor material for the complete predetermined thickness of the additional layer, but the penetration depth of the particle beam being insufficient to convert non-irradiated precursor material in the previous layer, and not irradiating the remaining part of the additional precursor material layer with the particle beam;

(e) repeating steps (a) through (d) until the desired structure has been formed; and

removing the non-irradiated precursor material from the substrate surface to leave the desired structure of solid material on the substrate.

16. The method of claim 15 in which during steps (a) through (e) the temperature of the substrate is kept below the freezing point of the precursor material, as a result of which step (a) results in the formation of a frozen layer.

17. The method of claim 15 in which irradiating a part of the precursor material layer with a particle beam, the precursor material converting in the presence of the particle beam into the desired solid material comprises irradiating a part of the precursor material layer with a particle beam, the precursor material reacting in the presence of the particle beam to form a precipitate material and a by-product material.

18. The method of claim 17 further comprising removing the by-product material from the substrate surface.

19. The method of claim 16 in which the non-irradiated precursor material is removed by warming the substrate to a temperature above the freezing point of the precursor material.

20. The method of claim 15 in which the particle bean comprises a charged particle beam.

21. The method of claim 15 in which the structure formed has overhanging features.

22. The method of claim 15 in which the precursor material forms a solid or liquid layer on the surface and does not desorb from the surface at the temperature of the substrate during steps (a) through (e).

23. The method of claim 15 in which, as a result of the parts of the precursor material layers irradiated by the particle beam in steps (a) through (d), at least one layer of solid material is formed on top of non-irradiated precursor material.