Light emitting device package and light emitting apparatus

• US 8,618,558 B2
• Filed: 09/15/2009
• Issued: 12/31/2013
• Est. Priority Date: 10/16/2008
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Kong, Sung Min
• Primary Examiner(s): Page, Dale E
• Application Number:
  US12/559,814
• Publication Number:
  US 20100096644A1
• Time in Patent Office: 1,568 Days
• Field of Search: 257/79, 257/E33.055, 257/E23.046, 362489-514
• US Class Current: 257/79
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

Disclosed are a light emitting device package and a light emitting apparatus. The light emitting device package comprises a package body comprising a light emitting surface inclined at an oblique angle with respect to a bottom surface, a plurality of lead electrodes in the package body, and at least one light emitting device electrically connected to the lead electrodes.

Claims

1. A light emitting device package comprising:

a package body comprising a light emitting part and a support part supporting the light emitting part, wherein a lower side surface of the light emitting part extends from a bottom surface of the support part such that the light emitting part is inclined at an oblique angle with respect to the bottom surface of the support part and wherein an end of the lower side surface of the light emitting part and an end of the bottom surface of the support part meet to form a joint edge;

a plurality of lead electrodes in the package body; and

at least one light emitting device electrically connected to the lead electrodes,

wherein the light emitting part includes sidewalls forming a cavity, the light emitting device and the lead electrodes being disposed in an inner region of the cavity,

wherein the light emitting part and the support part form a single body,

wherein a rear surface of the support part is formed between an upper surface of the support part and the bottom surface of the support part, facing the light emitting part and extending rearward, and

wherein the light emitting part protrudes in a direction opposite to the extension of the rear surface.

2. The light emitting device package of claim 1, wherein the lead electrodes and the light emitting device are inclined at the oblique angle with respect to the bottom surface of the support part.

3. The light emitting device package of claim 1, wherein a first end of each lead electrode is provided on the bottom surface of the support part through an outer portion of the package body.

4. The light emitting device package of claim 1, wherein the cavity has an inner wall which is perpendicular to a bottom surface of the cavity or outwardly inclined with respect to the bottom surface.

5. The light emitting device package of claim 1, wherein the light emitting part of the package body is inclined at an angle in a range of about 10°

to about 80°

with respect to the bottom surface of the support part.

6. The light emitting device package of claim 1, wherein the sidewalls are inclined at the oblique angle with respect to the bottom surface of the support part.

7. The light emitting device package of claim 1, wherein an upper portion of the rear surface of the support part of the package body protrudes.

8. The light emitting device package of claim 1, further comprising a transparent resin member or a transparent phosphor resin member in the cavity,

and wherein the light emitting device comprises at least one of a color LED, which comprises blue, green and red LED chips, and an UV LED chip.

9. The light emitting device package of claim 1, wherein the package body comprises a plastic resin material, and each lead electrode comprises a lead frame.

10. The light emitting device package of claim 1, wherein the package body comprises one selected from the group consisting of polyphthal amide (PPA), polyphenylene sulfide (PPS), polyacryl amide (PAA), and polyether ether ketone (PEEK).

11. A light emitting apparatus comprising:

a board comprising an interconnection pattern; and

a plurality of light emitting device packages each light emitting device package comprising a light emitting part and a support part supporting the light emitting part, wherein a lower side surface of the light emitting part extends from a bottom surface of the support part such that the light emitting part is inclined at an oblique angle with respect to the bottom surface of the support part parallel to the board, and wherein the light emitting part includes sidewalls forming a cavity,

wherein an end of the lower side surface of the light emitting part and an end of the bottom surface of the support part meet to form a joint edge,

wherein the light emitting part and the support part form a single body,

wherein a rear surface of the support part is formed between an upper surface of the support part and the bottom surface of the support part, facing the light emitting part and extending rearward, and

wherein the light emitting part protrudes in a direction opposite to the extension of the rear surface.

12. The light emitting apparatus of claim 11, wherein the light emitting device packages are arrayed in an identical direction or different directions.

13. The light emitting apparatus of claim 11, wherein the light emitting device packages are twisted at a predetermined angle with respect to each other.

14. The light emitting apparatus of claim 11, wherein each light emitting device package further comprises:

a plurality of lead electrodes in the cavity; and

at least one light emitting device electrically connected to the lead electrodes, wherein the at least one light emitting device is disposed in an inner region of the cavity.

15. The light emitting apparatus of claim 11, wherein each light emitting device package has a light emitting angle gradually increased or decreased within the oblique angle from a central portion of the board to an outer portion thereof.

16. The light emitting apparatus of claim 11, wherein the light emitting device packages are arranged in groups, wherein the groups are arrayed in a predetermined direction or in a zigzag manner.

17. The light emitting apparatus of claim 11, further comprising an optical sheet on the board.

18. A light emitting device package comprising:

a package body comprising a light emitting part and a support part supporting the light emitting part, wherein a lower side surface of the light emitting part extends from a bottom surface of the support part such that the light emitting part is inclined at an oblique angle with respect to the bottom surface of the support part and wherein an end of the lower side surface of the light emitting part and an end of the bottom surface of the support part meet to form a joint edge, wherein the light emitting part includes sidewalls forming a cavity;

a plurality of lead electrodes in the cavity;

a light emitting device in the cavity; and

a resin member in the cavity,

wherein the light emitting device is disposed in an inner region of the cavity,

wherein the light emitting part and the support part form a single body,

wherein a rear surface of the support part is formed between an upper surface of the support part and the bottom surface of the support part, facing the light emitting part and extending rearward, and

wherein the light emitting part protrudes in a direction opposite to the extension of the rear surface.

19. The light emitting device package of claim 18, wherein the resin member comprises a phosphor, and the light emitting device comprises at least one of a color LED and an UV LED chip, the color LED comprising blue, green, and red LED chips.

20. The light emitting device package of claim 18, wherein the light emitting part of the package body is inclined at an angle in a range of about 10°

to about 80°

with respect to a bottom surface of the package body.