Three dimensional structure memory

CAFC
  • US 8,629,542 B2
  • Filed: 03/17/2009
  • Issued: 01/14/2014
  • Est. Priority Date: 04/04/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A stacked integrated circuit comprising:

  • a circuit substrate;

    a first integrated circuit having circuitry formed on a front surface thereof, the front surface or a back surface being bonded to the circuit substrate; and

    one or more additional integrated circuits each having circuitry formed on respective front surfaces thereof, each additional integrated circuit having the front surface or a back surface thereof adjacent to the front surface or a back surface of an adjacent integrated circuit;

    wherein at least one of the first integrated circuit and the one or more additional integrated circuits is substantially flexible and comprises a substantially flexible semiconductor substrate of one piece made from a semiconductor wafer thinned by at least one of abrasion, etching and parting, and subsequently polished to form a polished surface.

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