System for dissipating heat energy

• US 8,631,855 B2
• Filed: 08/15/2008
• Issued: 01/21/2014
• Est. Priority Date: 08/15/2008
• Status: Active Grant

• Current Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Original Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Inventors: Maxik, Fredric S., Henderson, David, Bastien, Valerie
• Primary Examiner(s): CIRIC, LJILJANA V
• Application Number:
  US12/192,470
• Publication Number:
  US 20100038053A1
• Time in Patent Office: 1,985 Days
• Field of Search: 165/10, 165/104.11, 165/104.13, 165/104.14, 165/104.33
• US Class Current: 165/10
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A sustainable system for cooling at least one electronic device, for example a Light Emitting Diode (LED), and preferably a plurality of electronic devices, using at least one heat absorbing material contained within a housing that it is in thermal communication with the electronic devices. The heat absorbing materials may be present individually or in combinations thereof in order to achieve the desired heat absorption effect; the housing may include multiple chambers containing heat absorbing materials or combinations thereof.

Claims

1. A system for dissipating heat energy comprising:

at least one electronic device;

at least one housing, wherein said at least one housing is in thermal communication with said at least one electronic device; and

at least one first heat absorbing material and at least one second heat absorbing material contained within said at least one housing;

wherein said at least one housing comprises a first chamber and a second chamber, said first chamber containing said at least one first heat absorbing material and said second chamber containing said at least one second heat absorbing material.

2. The system of claim 1, wherein said at least one first heat absorbing material and said at least one second heat absorbing material are independently selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.

3. The system of claim 1, wherein said at least one electronic device comprises an LED.

4. The system of claim 1, wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises a phase change material.

5. The system of claim 1, wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises an ion crystal forming material.

6. The system of claim 1, wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises a material selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.

7. The system of claim 6, wherein said at least one first heat absorbing material and said at least one second heat absorbing material comprises two or more heat absorbing materials.

8. The system of claim 1, wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises a microencapsulated material.