Wireless IC device

• US 8,632,014 B2
• Filed: 07/28/2009
• Issued: 01/21/2014
• Est. Priority Date: 04/27/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Dokai, Yuya, Ikemoto, Nobuo
• Primary Examiner(s): Lee, Michael G
• Assistant Examiner(s): TARDIF, DAVID P
• Application Number:
  US12/510,347
• Publication Number:
  US 20090277967A1
• Time in Patent Office: 1,638 Days
• Field of Search: 235/492
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole

Abstract

A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

Claims

1. A wireless IC device comprising:

a radiating plate;

a wireless IC chip; and

a feeder circuit board on which the wireless IC chip is mounted, the feeder circuit board including a feeder circuit that includes a matching circuit which matches characteristic impedances of the radiating plate and the wireless IC chip, the matching circuit including an inductance element, the inductance element being coupled with the radiating plate;

wherein

the wireless IC chip is interposed between the radiating plate and the feeder circuit board, and the radiating plate and the feeder circuit board are joined to each other via the wireless IC chip;

the radiating plate is adhered to an article at a surface of the radiating plate on a side opposite to a side of the radiating plate on which the feeder circuit board and the wireless IC chip are disposed; and

the feeder circuit board completely covers the wireless IC chip and at least a portion of the radiating plate such that no portion of the wireless IC chip is exposed to the outside and the wireless IC chip is protected from shock from the outside.

2. The wireless IC device according to claim 1, wherein the radiating plate and the feeder circuit board are joined to each other at a periphery of the wireless IC chip when viewed in a direction perpendicular or substantially perpendicular to a surface of the feeder circuit board on which the wireless IC chip is mounted.

3. The wireless IC device according to claim 1, further comprising:

a resin component disposed between the radiating plate and the feeder circuit board at at least the periphery of the wireless IC chip when viewed in the direction perpendicular or substantially perpendicular to the surface of the feeder circuit board on which the wireless IC chip is mounted.

4. The wireless IC device according to claim 1, wherein the wireless IC chip is electrically insulated from the radiating plate.

5. The wireless IC device according to claim 1, wherein at least one of the radiating plate and the feeder circuit board is made of a flexible substrate.

6. The wireless IC device according to claim 1, wherein the wireless IC chip is in contact with the radiating plate at a surface remote from the feeder circuit board.

7. The wireless IC device according to claim 1, wherein the feeder circuit is electrically coupled with the radiating plate.

8. The wireless IC device according to claim 1, wherein the feeder circuit is magnetically coupled with the radiating plate.

9. The wireless IC device according to claim 1, wherein the feeder circuit is electrically and magnetically coupled with the radiating plate.

10. The wireless IC device according to claim 1, further comprising a molded resin component which is interposed between the radiating plate and the wireless IC chip.

11. The wireless IC device according to claim 1, the feeder circuit board is a multilayer substrate, and the inductance element is disposed inside the multilayer substrate.

12. The wireless IC device according to claim 10, wherein the radiating plate and the feeder circuit board are joined to each other at a periphery of the wireless IC chip when viewed in a direction perpendicular or substantially perpendicular to a surface of the feeder circuit board on which the wireless IC chip is mounted.

13. The wireless IC device according to claim 10, wherein the radiating plate is adhered to an article at a surface remote from the feeder circuit board and the wireless IC chip.

14. The wireless IC device according to claim 10, wherein at least one of the radiating plate and the feeder circuit board is made of a flexible substrate.

15. The wireless IC device according to claim 10, wherein the feeder circuit is electrically coupled with the radiating plate.

16. The wireless IC device according to claim 10, wherein the feeder circuit is magnetically coupled with the radiating plate.

17. The wireless IC device according to claim 10, wherein the feeder circuit is electrically and magnetically coupled with the radiating plate.