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LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof

  • US 8,633,643 B2
  • Filed: 11/30/2010
  • Issued: 01/21/2014
  • Est. Priority Date: 11/30/2009
  • Status: Expired due to Fees
First Claim
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1. A light emitting diode package module comprising:

  • a heat radiation substrate, which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit;

    a package substrate arranged on the heat radiation substrate;

    a light emitting diode chip mounted on one surface of the package substrate;

    an electrode pad disposed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and

    a heat radiation pad disposed on the other surface of the package substrate and electrically insulated from the electrode pad,wherein the electrode pad is bonded to the electrode unit, and the heat radiation pad is bonded to the heat radiation unit.

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