LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
First Claim
Patent Images
1. A light emitting diode package module comprising:
- a heat radiation substrate, which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit;
a package substrate arranged on the heat radiation substrate;
a light emitting diode chip mounted on one surface of the package substrate;
an electrode pad disposed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and
a heat radiation pad disposed on the other surface of the package substrate and electrically insulated from the electrode pad,wherein the electrode pad is bonded to the electrode unit, and the heat radiation pad is bonded to the heat radiation unit.
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
25 Citations
21 Claims
-
1. A light emitting diode package module comprising:
-
a heat radiation substrate, which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit; a package substrate arranged on the heat radiation substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad disposed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad disposed on the other surface of the package substrate and electrically insulated from the electrode pad, wherein the electrode pad is bonded to the electrode unit, and the heat radiation pad is bonded to the heat radiation unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A head lamp module comprising:
-
a light emitting diode package module for generating light; an optical module for changing distribution angle of light generated from the light emitting diode package module; a heat radiation module for emitting heat of the light emitting diode package to the outside; and a driver module electrically connected to the light emitting diode package module to thereby control operation of the light emitting diode package module, wherein the light emitting diode package module comprises; a heat radiation substrate which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit; a package substrate arranged on the heat radiation substrate; a heat radiation pad disposed on the package substrate to be opposite to the heat radiation unit and bonded to the heat radiation unit; an electrode pad disposed on the package substrate to be opposite to the electrode unit and bonded to the electrode unit; and a light emitting diode chip mounted on the package substrate and electrically connected to the electrode pad. - View Dependent Claims (20, 21)
-
Specification