×

Micro- and/or nano-structured packaging material

  • US 8,646,604 B2
  • Filed: 01/13/2009
  • Issued: 02/11/2014
  • Est. Priority Date: 01/30/2008
  • Status: Active Grant
First Claim
Patent Images

1. A web-form packaging material comprising:

  • at least one layer, comprising packaging material surface, of a sealable material;

    wherein the packaging material surface has;

    a multiplicity of recesses; and

    multiplicity of non-recessed regions;

    wherein a maximum distance between two adjacent recesses and a maximum distance between two adjacent non-recessed regions are each less than five times a thickness of the packaging material; and

    wherein a depth of the recesses is not less than 1.2 nanometers and not more than 95% of the packaging material thickness.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×