Package for an implantable device

• US 8,649,868 B2
• Filed: 12/07/2012
• Issued: 02/11/2014
• Est. Priority Date: 03/24/1999
• Status: Expired due to Fees

• Current Assignee: Second Sight Medical Products, Inc.
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Greenberg, Robert J., Schulman, Joseph H.
• Primary Examiner(s): Gedeon, Brian T
• Application Number:
  US13/708,551
• Publication Number:
  US 20130096661A1
• Time in Patent Office: 431 Days
• Field of Search: 607 36- 38, 607/115
• US Class Current: 607/36
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: A61N 1/37247 User interfaces, e.g. input or presentation means
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package is formed from a thin film of hermetic biocompatible material to minimize the size of the implanted device.

Claims

1. An implantable device, comprising:

an electrically non-conductive substrate having and interior surface, and an exterior surface on an opposite of said electrically non-conductive substrate from the interior surface;

a plurality of electrically conductive feedthroughs through the electrically non-conductive substrate and substantially flush with the exterior surface of the electrically non-conductive substrate;

a circuit attached to the interior surface of the electrically non-conductive substrate; and

a cover bonded to the electrically non-conductive substrate, the cover, the electrically non-conductive substrate and the electrically conductive feedthroughs forming a hermetic package.

2. The implantable device according to claim 1, wherein the cover is metal and the electrically non-conductive base is ceramic and further comprising a braze joint between the cover and the electrically non-conductive substrate.

3. The implantable device according to claim 1, further comprising electrodes suitable to stimulate neural tissue and electrically coupled to the feedthroughs.

4. The implantable device according to claim 3, wherein the electrodes are suitable to stimulate visual neurons to create artificial vision.

5. The implantable device according to claim 4, wherein the electrodes are bonded to the feedthroughs by insulated conductors.

6. The implantable device according to claim 1, wherein the feedthroughs are straight feedthroughs.

7. The implantable device according to claim 1, wherein the electronics unit is a flip-chip bonded to the interior surface of the electrically non-conductive base.

8. The implantable device according to claim 1, wherein the electrically non-conductive base comprises ceramic.

9. The implantable device according to claim 8, wherein the ceramic comprises aluminum oxide.

10. The implantable device according to claim 1, wherein the cover contains metal.

11. The implantable device according to claim 1, wherein the cover comprises a ring and a lid.

12. The implantable device according to claim 1, wherein electrodes are electroplated on the feedthroughs.

13. The implantable device according to claim 2, wherein the braze joint comprises titanium.

14. The implantable device according to claim 2, wherein the braze joint comprises nickel.

15. The implantable device according to claim 1, wherein the braze joint comprises gold.

16. The implantable device according to claim 1, wherein said feedthroughs are straight through the electrically non-conductive substrate.