SOI device with DTI and STI

• US 8,652,888 B2
• Filed: 06/24/2013
• Issued: 02/18/2014
• Est. Priority Date: 04/17/2011
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Cheng, Kangguo, Doris, Bruce B., Khakifirooz, Ali, Kerber, Pranita
• Primary Examiner(s): BOOTH, RICHARD A
• Application Number:
  US13/924,851
• Publication Number:
  US 20130288451A1
• Time in Patent Office: 239 Days
• Field of Search: 438151-166, 438/296, 257/E21.561
• US Class Current: 438/155
• CPC Class Codes: H01L 21/743 Making of internal connections, substrate contacts
• CPC Class Codes: H01L 21/76229 Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
• CPC Class Codes: H01L 21/76232 of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls H01L21/76229 takes precedence
• CPC Class Codes: H01L 21/76283 Lateral isolation by refilling of trenches with dielectric material
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688

Abstract

A method of forming an SOI structure which includes providing a semiconductor on insulator (SOI) substrate having an SOI layer, an intermediate buried oxide (BOX) layer and a bottom substrate; patterning the SOI layer to form first and second openings in the SOI layer; extending the first openings into the bottom substrate; enlarging the first openings within the bottom substrate; filling the first and second openings with an insulator material to form deep trench isolations (DTIs) from the first openings and shallow trench isolations (STIs) from the second openings; implanting in the bottom substrate between the DTIs to form wells; and forming semiconductor devices in the SOI layer between the DTIs with each semiconductor device being separated from an adjacent semiconductor device by an STI.

Claims

1. A method of forming an SOI structure comprising:

providing a semiconductor on insulator (SOI) substrate having an SOI layer, an intermediate buried oxide (BOX) layer and a bottom substrate;

patterning the SOI layer to form first and second openings in the SOI layer;

extending the first openings into the bottom substrate;

enlarging the first openings within the bottom substrate;

filling the first and second openings with an insulator material to form deep trench isolations (DM) from the first openings and shallow trench isolations (STIs) from the second openings;

implanting in the bottom substrate between the DTIs to form wells; and

forming semiconductor devices in the SOI layer between the DTIs with each semiconductor device being separated from an adjacent semiconductor device by an STI.

2. The method of claim 1 wherein the SOI substrate is an extremely thin SOI substrate.

3. The method of claim 2 wherein the SOI layer has a thickness of 3 to 15 nanometers.

4. The method of claim 1 wherein the BOX layer has a thickness of 10 to 140 nanometers.

5. The method of claim 1 wherein extending the first openings into the bottom substrate includes etching the BOX layer and the substrate by an etching process that leaves a passivating residue on the SOI layer and BOX layer while the substrate is being etched.

6. The method of claim 1 wherein after patterning the SOI layer to form first and second openings in the SOI layer and before extending the first openings into the bottom substrate, forming spacers on sidewalls of the first and second openings.

7. The method of claim 6 wherein the spacers comprise a material selected from the group consisting of oxide, nitride, alumina and a high dielectric constant material.

8. The method of claim 1 wherein after patterning the SOI layer to form first and second openings in the SOI layer and before extending the first openings into the bottom substrate, conformally depositing a spacer material on sidewalls and bottoms of the first and second openings.

9. The method of claim 1 wherein the spacer material comprises a material selected from the group consisting of oxide, nitride, alumina and a high dielectric constant material.

10. The method of claim 1 wherein patterning the SOI layer to form first and second openings in the SOI layer includes patterning the BOX layer so as to extend the first and second openings through the BOX layer.

11. The method of claim 10 wherein after patterning the SOI layer and BOX layer to form first and second openings in the SOI layer and BOX layer and before extending the first openings into the bottom substrate, forming spacers on sidewalls of the first and second openings.

12. The method of claim 11 wherein the spacers comprise a material selected from the group consisting of oxide, nitride, alumina and a high dielectric constant material.

13. The method of claim 10 wherein after patterning the SOI layer and BOX layer to form first and second openings in the SOI layer and BOX layer and before extending the first openings into the bottom substrate, conformally depositing a spacer material on sidewalls and bottoms of the first and second openings.

14. The method of claim 13 wherein the spacer material comprises a material selected from the group consisting of a oxide, nitride, alumina, and a high dielectric constant material.