Electronic component package fabrication method and structure

  • US 8,653,674 B1
  • Filed: 09/15/2011
  • Issued: 02/18/2014
  • Est. Priority Date: 09/15/2011
  • Status: Active Grant
First Claim
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1. A method comprising:

  • coupling a redistribution pattern to an active surface of an electronic component to form a distributed electronic component, the entire redistribution pattern being coupled to the active surface;

    coupling the redistributed electronic component to a carrier; and

    overmolding the redistributed electronic component.

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