Encapsulated organic electronic devices and method for making same

• US 8,657,985 B2
• Filed: 03/31/2011
• Issued: 02/25/2014
• Est. Priority Date: 07/12/2000
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: McCormick, Fred Boyle, Baude, Paul Frederic, Vernstrom, George David
• Primary Examiner(s): Tucker, Philip
• Assistant Examiner(s): HOGAN, SHAWN FRANCIS
• Application Number:
  US13/077,152
• Publication Number:
  US 20110177637A1
• Time in Patent Office: 1,062 Days
• Field of Search: 156/249, 156/230, 438/28, 257/E33.056
• US Class Current: 156/249
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/16 using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Abstract

Encapsulated organic electronic devices including organic light emitting diodes are made using an adhesive component as a mask while the device is being constructed. An adhesive-coated liner can be applied to the device substrate and openings created therein by removing portions of the liner and adhesive, or a patterned adhesive layer having openings therein can be formed on the device substrate, followed by deposition of the device layers and application of a sealing layer.

Claims

1. A method of making organic electronic devices (OEDs) in a roll-to-roll continuous web process, comprising the steps of:

providing a roll of flexible substrate with an adhesive-coated liner, wherein the substrate is a continuous web during the process, the adhesive side of the liner is applied to the substrate, and the adhesive is patterned to form an adhesive mask having openings defined by the pattern and the liner has a plurality of openings coinciding with the openings in the pattern of the adhesive mask;

moving the substrate along a plurality of rolls, wherein with at least one of the plurality of rolls the liner is against the one roll and the substrate located opposite the one roll and wherein with at least another one of the plurality of rolls the substrate is against the another one roll and the liner located opposite the another one roll;

depositing OED elements on the substrate in conjunction with moving the substrate along the plurality of rolls, wherein the OED elements include at least an active organic material, and wherein the OED elements are deposited through the plurality of openings in the liner and through the adhesive mask;

removing the liner from the substrate using one of the plurality of rolls feeding the liner to a first take-up roll while leaving a remaining portion of the adhesive mask on the substrate around each of the deposited OED elements at a location of each of the plurality of openings;

applying a sealing layer over the adhesive mask on the substrate and adhering the sealing layer by passing the substrate with the sealing layer between a pair of the plurality of rolls located on opposite sides of the substrate, wherein after adhering the sealing layer the remaining portion of the adhesive mask forms an edge seal completely surrounding each of the deposited OED elements between the sealing layer and the substrate at a location of each of the plurality of openings; and

collecting the substrate with the edge-sealed OED elements and the sealing layer on a second take-up roll,

wherein each of the edge-sealed OED elements comprises an OED capable of independent operation after the substrate is singulated to separate the edge-sealed OED elements.

2. The method of claim 1, wherein the providing step includes providing an electrode coated substrate with the electrode located between the substrate and the liner.

3. The method of claim 1, wherein the depositing step includes depositing an electrode on the substrate through the plurality of openings before depositing the active organic material.

4. The method of claim 1, wherein the depositing step includes using directional deposition of the active organic material onto the substrate.

5. The method of claim 1, wherein the depositing step includes depositing the OED elements through first and second adhesive-coated liners having patterned adhesive masks, wherein the first adhesive-coated liner is closer to the substrate than the second adhesive-coated liner and the plurality of openings in the first adhesive-coated liner are larger than the plurality of openings in the second adhesive coated liner.

6. The method of claim 1, wherein the applying step includes applying a protective layer as the sealing layer over the adhesive mask on the substrate.

7. The method of claim 1, wherein the applying step includes applying an electrode as the sealing layer over the adhesive mask on the substrate.

8. The method of claim 1, wherein the depositing step includes depositing the active organic material in a pattern through the plurality of openings.

9. The method of claim 1, wherein the depositing step includes depositing an organic light emitter layer for an organic light emitting diode device as the OED.

10. A method of making multiple organic electronic devices (OEDs) on a single substrate, comprising the steps of:

providing a single substrate with an adhesive-coated liner, wherein the adhesive is patterned to form an adhesive mask having openings defined by the pattern, wherein the adhesive side of the liner is applied to the substrate and the liner has a plurality of openings coinciding with the openings in the pattern of the adhesive mask;

depositing OED elements on the substrate, wherein the OED elements include at least an active organic material, and wherein the OED elements are deposited through the plurality of openings in the liner and through the adhesive mask;

removing the liner from the substrate while leaving a remaining portion of the adhesive mask on the substrate around each of the deposited OED elements at a location of each of the plurality of openings;

applying a sealing layer over the adhesive mask on the substrate and adhering the sealing layer, wherein after adhering the sealing layer the remaining portion of the adhesive mask forms an edge seal completely surrounding each of the deposited OED elements between the sealing layer and the substrate at a location of each of the plurality of openings; and

singulating the substrate to separate the edge-sealed OED elements,

wherein each of the edge-sealed OED elements comprises an OED capable of independent operation after the substrate is singulated to separate the edge-sealed OED elements.

11. The method of claim 10, wherein the providing step includes providing an electrode coated substrate with the electrode located between the substrate and the liner.

12. The method of claim 10, wherein the depositing step includes depositing an electrode on the substrate through the plurality of openings before depositing the active organic material.

13. The method of claim 10, wherein the depositing step includes using directional deposition of the active organic material onto the substrate.

14. The method of claim 10, wherein the depositing step includes depositing the OED elements through first and second adhesive-coated liners having patterned adhesive masks, wherein the first adhesive-coated liner is closer to the substrate than the second adhesive-coated liner and the plurality of openings in the first adhesive-coated liner are larger than the plurality of openings in the second adhesive coated liner.

15. The method of claim 10, wherein the applying step includes applying a protective layer as the sealing layer over the adhesive mask on the substrate.

16. The method of claim 10, wherein the applying step includes applying an electrode as the sealing layer over the adhesive mask on the substrate.

17. The method of claim 10, wherein the depositing step includes depositing the active organic material in a pattern through the plurality of openings.

18. The method of claim 10, further comprising attaching electrically conductive leads to each of the edge-sealed OED elements after the singulating step.

19. The method of claim 10, wherein the providing step includes providing a flexible substrate.

20. The method of claim 10, wherein the depositing step includes depositing an organic light emitter layer for an organic light emitting diode device as the OED.