Wafer-scale package including power source

• US 8,666,505 B2
• Filed: 01/28/2011
• Issued: 03/04/2014
• Est. Priority Date: 10/26/2010
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: O'Brien, Richard J., Day, John K., Gerrish, Paul F., Mattes, Michael F., Ruben, David A., Grief, Malcolm K.
• Primary Examiner(s): MALAMUD, DEBORAH LESLIE
• Application Number:
  US13/016,253
• Publication Number:
  US 20120101540A1
• Time in Patent Office: 1,131 Days
• Field of Search: 607 1- 2, 607/9, 607/36, 607/115, 438/25
• US Class Current: 607/115
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/03 Detecting, measuring or recording fluid pressure within the body other than blood pressure, e.g. cerebral pressure; Measuring pressure in body tissues or organs A61B5/205 takes precedence
• CPC Class Codes: A61B 5/11 Measuring movement of the entire body or parts thereof, e.g. head or hand tremor, mobility of a limb for measuring pulse A61B5/02 ;A61B5/1038 takes precedence; motion detection to correct for motion artifacts in physiological signals A61B5/721
• CPC Class Codes: A61N 1/37211 Means for communicating with stimulators
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/12 Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

Claims

1. A medical device comprising:

a first substrate that includes at least one of a first semiconductor material and a first insulating material;

a second substrate that includes at least one of a second semiconductor material and a second insulating material, a first major surface of the second substrate bonded to the first substrate such that the first and second substrates define a first enclosed cavity between the first and second substrates;

a third substrate that includes at least one of a second semiconductor material and a second insulating material, the third substrate bonded to a second major surface of the second substrate such that the second and third substrates define a second enclosed cavity between the second and third substrates;

an encapsulant cover disposed over outer surfaces of the first and third surfaces to seal the device;

a control module disposed within at least one of the first enclosed cavity and the second enclosed cavity, the control module configured to at least one of;

determine a physiological parameter of a patient and

deliver electrical stimulation to the patient; and

an energy storage device disposed within at least one of the first enclosed cavity and the second enclosed cavity configured to supply power to the control module.

2. The medical device of claim 1, wherein the first and second substrates comprise glass substrates.

3. The medical device of claim 2, further comprising a silicon layer deposited within the bond between the first and second substrates.

4. The medical device of claim 2, further comprising a light absorbing layer deposited within the bond between the first and second substrates, wherein the light absorbing layer absorbs light at a wavelength that is transmitted by one of the first and second substrates.

5. The medical device of claim 1, wherein the first and second substrates comprise semiconductor substrates.

6. The medical device of claim 1, wherein one of the first and second substrates comprises a glass substrate, and wherein the other one of the first and second substrates comprises a semiconductor substrate.

7. The medical device of claim 1, wherein the thickness of the device including the thickness of the first and second substrates and the depth of each of the first enclosed cavity and the second enclosed cavity is less than 3 millimeters.

8. The medical device of claim 1, wherein at least a portion of the control module is disposed on a die, and wherein the die is mounted to one of the first and second substrates.

9. The medical device of claim 1, wherein at least a portion of the control module is fabricated into one of the first and second substrates.

10. The medical device of claim 1, further comprising a sensor housed within one of the first enclosed cavity and the second enclosed cavity.

11. The medical device of claim 10, wherein the sensor includes one of a temperature sensor, a pressure sensor, an accelerometer, and a gyroscopic sensor, and wherein the control module determines at least one of a temperature of the patient, a pressure within the patient, an activity level of the patient, and a posture of the patient based on signals received from the sensor.

12. The medical device of claim 1, further comprising an antenna, wherein the control module at least one of transmits and receives data via the antenna.

13. The medical device of claim 1, wherein the energy storage device includes one of a battery and a capacitor.

14. The medical device of claim 13, wherein the energy storage device includes a solid state battery.

15. The medical device of claim 1, further comprising an electrical connection that extends from the control module through one of the first and second substrates to an external surface of the device.

16. The medical device of claim 15, wherein the control module is configured to provide electrical stimulation to the patient via the electrical connection.

17. The medical device of claim 16, wherein the electrical stimulation includes one of cardiac electrical stimulation and neurostimulation.

18. The medical device of claim 15, wherein the control module is configured to monitor electrical physiological signals of the patient via the electrical connection.

19. The medical device of claim 1, wherein the energy storage device is formed within a recess defined by one of the first and third substrates.

20. The medical device of claim 1, further comprising an external pad for coupling the control module to a second medical device.