Power lamp package

• US 8,669,572 B2
• Filed: 06/10/2005
• Issued: 03/11/2014
• Est. Priority Date: 06/10/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Leung, Michael, Ibbetson, James
• Primary Examiner(s): Fahmy, Wael
• Assistant Examiner(s): SALERNO, SARAH KATE
• Application Number:
  US11/149,998
• Publication Number:
  US 20060278882A1
• Time in Patent Office: 3,196 Days
• Field of Search: 257/433, 257/729, 257/730, 257/98, 361/600
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Adhesive-free assembly of the substrate and reflector components of a semiconductor die package is achieved by injection molding the reflector onto a surface of the substrate or by molding the reflector separate from the substrate and securing it in place on the substrate through deformation of a portion of the reflector. The reflector may be made reflective either by molding the reflector using a light scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector. A variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be made.

Claims

1. A semiconductor device die package comprising:

a substrate having a first surface for supporting a semiconductor device, a second surface opposite said first surface, and one or more substrate holes in said substrate at said first surface, wherein said substrate at least partially comprises one or more ceramic materials, and

a reflector cup on said substrate surrounding one or more light emitting devices, said reflector cup comprising a singular aperture exposing and surrounding all of said one or more light emitting devices, said reflector cup further comprising a plurality of moldable posts, each of which cooperates with a respective one of said substrate holes to anchor said reflector cup to said substrate, said posts not extending beyond said second surface, wherein said reflector cup comprises a high temperature resistant material, said reflector cup further comprising an inner wall and an outer wall separated by a moat, said inner wall and an inner surface of said outer wall both facing in a direction toward said one or more light emitting devices, and at least a portion of said inner wall is reflective and is in a form of a ring.

2. The package of claim 1, wherein said substrate holes pass at least partially through said substrate.

3. The package of claim 2, wherein each of said posts is inserted into a respective one of said substrate holes to anchor said reflector cup to said substrate.

4. The package of claim 1, wherein said one or more substrate holes pass through said substrate between said first and second surfaces.

5. The package of claim 4, wherein each of said posts passes through its respective one of said substrate holes and extends to the second surface to secure said reflector cup to said substrate.

6. The package of claim 1, wherein the substrate is formed of an electrically insulating material.

7. The package of claim 1, wherein the material comprises a plastic.

8. The package of claim 7, wherein the material is a Novolac resin.

9. The package of claim 1, wherein said reflector cup is formed of a reflective material.

10. The package of claim 9, wherein said material comprises a liquid crystal polymer.

11. The package of claim 1, wherein the reflector cup is formed of light scattering moldable plastic.

12. The package of claim 1, wherein said reflector cup further comprises a reflective element.

13. The package of claim 12, wherein the reflective element comprises a foil material.

14. The package of claim 13, wherein the foil material has a substantially uniform thickness and conforms to a surface of said reflector cup to provide an inner surface having a surface shape substantially the same as the surface of said reflector cup.

15. The package of claim 13, wherein the foil material has a varying thickness and one side that conforms to a surface of said reflector cup to provide an inner surface having a surface shape different than the surface of said reflector cup.

16. The package of claim 12, wherein the reflective element comprises a snap-fit structure and reflector cup comprises a snap-fit structure configured to engage the snap-fit structure of the reflective element.

17. The package of claim 1, wherein said posts extend through said substrate such that said posts are flush with said second surface.

18. The package of claim 1, wherein said substrate comprises a thermally conductive material.

19. A light emitting diode (LED) die package comprising:

a substrate having a first surface with a mounting pad and one or more first mounting devices, wherein said first mounting devices comprise a plurality of holes in said substrate at said first surface, said holes surrounded by said substrate, wherein said substrate at least partially comprises one or more ceramic materials;

one or more LEDs mounted on said mounting pad;

a reflector cup having a singular cavity exposing and surrounding all of said one or more LEDs, said reflector cup further comprising one or more second mounting devices, said reflector cup anchored to said substrate by said first mounting devices cooperating with said second mounting devices, and wherein said reflector cup comprises a high temperature resistant material, said reflector cup further comprising an inner wall and an outer wall separated by a moat, said inner wall and an inner surface of said outer wall both facing the center of said cavity; and

a reflective element associated with said reflector cup to reflect light from said LED, wherein a portion of said reflective element associated with at least a portion of said inner wall is capable of reflecting light from said LED and is in a form of a ring.

20. The package of claim 19, wherein said reflector cup has an inner surface substantially surrounding said LED, said reflective element associated with said inner surface.

21. The package of claim 19, wherein said second mounting devices comprise one or more posts, each of which cooperates with a respective one of said holes to anchor said reflector cup to said substrate.

22. A light emitting diode (LED) die package comprising:

a substrate having first and second surfaces and a mounting pad on the first surface;

an LED assembly comprising one or more LEDs mounted on said mounting pad;

a base secured to the first surface, the base having an inner surface substantially surrounding said LEDs and the mounting pad; and

a reflective element associated with the inner surface, said reflective element comprising a singular cavity exposing and surrounding said LED assembly, wherein the reflective element further comprises a snap-fit structure with said inner surface, and wherein said reflective element comprises a high temperature resistant material, said reflective element further comprising said inner surface and a second inner surface separated by a moat, said inner surface and said second inner surface both facing the center of said cavity, wherein at least a portion of said inner surface is reflective.

23. The package of claim 22, wherein the reflective element has a substantially uniform thickness and conforms to the inner surface to provide a reflective inner surface having a surface shape substantially the same as the inner surface of the base.

24. The package of claim 22, wherein the reflective element has a varying thickness and one side that conforms to the inner surface to provide a reflective inner surface having a surface shape different than the inner surface of the base.

25. The package of claim 22, wherein the reflective element is press fit to the inner surface.

26. The package of claim 22, wherein the base comprises a snap-fit structure configured to engage the snap-fit structure of the reflective element.

27. A semiconductor device die package comprising:

a substrate having a first surface for supporting a semiconductor device, and one or more substrate holes in said substrate at said first surface, said holes surrounded by said substrate, wherein said substrate at least partially comprises one or more ceramic materials, and

a single reflector cup on said substrate surrounding one or more light emitting devices, said single reflector cup comprising a singular aperture exposing and surrounding all of said one or more light emitting devices, said reflector cup further comprising a plurality of moldable posts, each of which cooperates with a respective one of said substrate holes to anchor said single reflector cup to said substrate, and wherein said reflector cup comprises a high temperature resistant material, said single reflector cup further comprising an inner wall and an outer wall separated by a moat, said inner wall and an inner surface of said outer wall both facing toward said one or more light emitting devices, and at least a portion of said inner wall is reflective.

28. A semiconductor device die package comprising:

a substrate having a first surface for supporting a semiconductor device, wherein said substrate at least partially comprises one or more ceramic materials, and

a single reflector cup injection molded on said substrate, said reflector cup surrounding one or more light emitting devices and comprising a singular aperture exposing and surrounding all of said one or more light emitting devices, said single reflector cup further comprising an inner wall and an outer wall separated by a moat, said inner wall and an inner surface of said outer wall both facing toward said one or more light emitting devices, and at least a portion of said inner wall comprises a snap-fit structure which interacts with another snap-fit structure on a reflective element that is in a form of a ring.

29. A semiconductor device die package comprising:

a ceramic substrate having a first surface for supporting a semiconductor device, and one or more substrate holes in said substrate at said first surface; and

a single reflector cup mountable on said substrate and provided to surround one or more light emitting devices, said single reflector cup mountable on said substrate via a plurality of moldable posts, each of said moldable posts cooperating with a respective one of said substrate holes to anchor said single reflector cup to said substrate, said single reflector cup further comprising an inner wall and an outer wall separated by a moat, said inner wall and an inner surface of said outer wall both facing toward said one or more light emitting devices, and at least a portion of said inner wall is reflective and is in a form of a ring.