Wireless IC device and component for wireless IC device

• US 8,676,117 B2
• Filed: 08/06/2012
• Issued: 03/18/2014
• Est. Priority Date: 01/19/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Kato, Noboru, Ishino, Satoshi
• Primary Examiner(s): Trinh, Sonny
• Application Number:
  US13/567,108
• Publication Number:
  US 20120292396A1
• Time in Patent Office: 589 Days
• Field of Search: 455/41.1, 455/41.2, 455/334, 455/39, 455/42, 455/327, 455/333, 455/130, 340/10.1, 340/10.3, 340/10.42
• US Class Current: 455/41.1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: Y02D 30/70 : in wireless communication networks

Abstract

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Claims

1. A wireless IC device for an RFID system comprising:

a wireless IC chip;

a power supply circuit board including a power supply circuit connected to the wireless IC chip; and

a radiation pattern, to which the power supply circuit board is adhered or disposed adjacent, and arranged to perform at least one of radiating a transmission signal supplied from the power supply circuit and receiving a reception signal and supplying the reception signal to the power supply circuit;

wherein

the power supply circuit includes a matching circuit to perform matching between an impedance of the wireless IC chip and an impedance of the radiation pattern; and

the matching circuit is located inside of the power supply circuit board.

2. The wireless IC device for an RFID system according to claim 1, wherein the power supply circuit includes a resonant circuit including the matching circuit.

3. The wireless IC device for an RFID system according to claim 2, wherein the resonant circuit is a concentrated-constant resonant circuit including a capacitor pattern and an inductor pattern.

4. The wireless IC device for an RFID system according to claim 3, wherein the resonant circuit includes a plurality of LC series resonant circuits or a plurality of LC parallel resonant circuits.

5. The wireless IC device for an RFID system according to claim 1, wherein

the power supply circuit board is a multilayer board including a plurality of dielectric layers or a plurality of magnetic layers;

and

the matching circuit is provided inside of the multilayer board.

6. The wireless IC device for an RFID system according to claim 1, wherein

the power supply circuit board is a rigid board;

and

the wireless IC chip is mounted on the power supply circuit board.

7. The wireless IC device for an RFID system according to claim 1, wherein

the power supply circuit board includes a board-side electrode pattern;

and

the power supply circuit board and the radiation pattern are connected by DC connection via the board-side electrode pattern.

8. The wireless IC device for an RFID system according to claim 1, wherein

the radiation pattern includes an opening portion;

and

the power supply circuit board is arranged adjacent to the opening portion.

9. The wireless IC device for an RFID system according to claim 8, wherein the opening portion is partially disposed in the radiation pattern.

10. The wireless IC device for an TFID system according to claim 9, wherein

the power supply circuit includes a coil-shaped electrode pattern;

and

a winding axis of the coil-shaped electrode pattern is substantially perpendicular to a surface of the radiation pattern.