Illuminating device and method for manufacturing the same

• US 8,678,617 B2
• Filed: 10/04/2012
• Issued: 03/25/2014
• Est. Priority Date: 09/29/2009
• Status: Active Grant

• Current Assignee: Liang MENG Plastic Share Company Limited
• Original Assignee: Liang MENG Plastic Share Company Limited
• Inventors: Lai, Kuang-Chu
• Primary Examiner(s): Sawhney, Hargobind S
• Application Number:
  US13/645,487
• Publication Number:
  US 20130044484A1
• Time in Patent Office: 537 Days
• Field of Search: 362/84, 362/217.01, 362/217.1, 362/217.11, 362/223, 362/249.01, 362/249.02, 362/294, 362/249.11, 362/310, 362/311.02, 362/540, 362543-547, 362/800, 362/806, 362/812, 257/88, 257 98-100, 257/433, 257/686, 257/E33.059, 257/E33.067, 257/E33.073, 438/26, 438/27, 438/116, 438125-127, 438/478, 438/479, 438/737, 438/738, 438/779, 438/977
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/00 Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof H10K50/00 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components having potential barriers, specially adapted for light emission H01L27/15; semiconductor lasers H01S5/00

Abstract

A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Claims

1. An illuminating device, including:

a flat plate;

at least one light-emitting element fixed on the flat plate;

a transparent cap covering the at least one light-emitting element;

a transparent body over-molded outside the flat plate and the transparent cap; and

a lamp cover over-molded outside the flat plate and the transparent body,

wherein one side surface of the flat plate is provided with a groove, and the transparent body is inserted into the groove and fixed thereto.