Wired circuit board and producing method thereof

  • US 8,692,126 B2
  • Filed: 08/16/2010
  • Issued: 04/08/2014
  • Est. Priority Date: 08/26/2009
  • Status: Active Grant
First Claim
Patent Images

1. A wired circuit board, comprising:

  • a metal supporting layer;

    an insulating layer formed on the metal supporting layer; and

    a conductive layer formed on the insulating layer,wherein a reference hole for positioning is formed in the metal supporting layer, and a stepped portion is formed so as to surround on all sides the reference hole; and

    wherein the stepped portion is formed in at least one of;

    a) the same layer as the insulating layer, b) the same layer as the conductive layer, or c) directly in the metal supporting layer.

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