Wired circuit board and producing method thereof
DCFirst Claim
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1. A wired circuit board, comprising:
- a metal supporting layer;
an insulating layer formed on the metal supporting layer; and
a conductive layer formed on the insulating layer,wherein a reference hole for positioning is formed in the metal supporting layer, and a stepped portion is formed so as to surround on all sides the reference hole; and
wherein the stepped portion is formed in at least one of;
a) the same layer as the insulating layer, b) the same layer as the conductive layer, or c) directly in the metal supporting layer.
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Abstract
A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.
9 Citations
12 Claims
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1. A wired circuit board, comprising:
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a metal supporting layer; an insulating layer formed on the metal supporting layer; and a conductive layer formed on the insulating layer, wherein a reference hole for positioning is formed in the metal supporting layer, and a stepped portion is formed so as to surround on all sides the reference hole; and wherein the stepped portion is formed in at least one of;
a) the same layer as the insulating layer, b) the same layer as the conductive layer, or c) directly in the metal supporting layer. - View Dependent Claims (2, 3, 4, 5, 6, 10, 11)
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7. A producing method of a wired circuit board, comprising:
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the step of forming a metal supporting layer, forming an insulating layer on the metal supporting layer, and forming a conductive layer on the insulating layer; the step of forming a stepped portion, which is formed in at least one of;
a) the same layer as the insulating layer, b) the same layer as the conductive layer, or c) directly in the metal supporting layer, such that a to-be-removed region for boring a reference hole used for positioning is surrounded on all sides by the stepped portion; anda reference hole forming step of etching the to-be-removed region of the metal supporting layer to form the reference hole, wherein the reference hole forming step includes the steps of; forming an etching resist so as to cover the stepped portion therewith on one side of the metal supporting layer in a thickness direction and expose the to-be-removed region on the other side of the metal supporting layer in the thickness direction; removing the to-be-removed region exposed from the etching resist by etching; and removing the etching resist. - View Dependent Claims (8, 9)
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12. A wired circuit board, comprising:
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a metal supporting layer; an insulating layer formed on the metal supporting layer; and a conductive layer formed on the insulating layer, wherein a reference hole for positioning is formed in the metal supporting layer, and a stepped portion is formed so as to surround on all sides the reference hole; and wherein the stepped portion is formed in the same layer as the insulating layer and/or the conductive layer.
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Specification