×

Orthosis for gait modulation

  • US 8,694,110 B2
  • Filed: 06/25/2012
  • Issued: 04/08/2014
  • Est. Priority Date: 11/16/2005
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus, comprising:

  • a first orthosis layer configured to substantially envelop a portion of a limb, the first orthosis layer including a retention portion and a mounting portion, the retention portion configured to retain the first orthosis layer about the portion of the limb, the mounting portion configured to be coupled to an electrical stimulator;

    a second orthosis layer coupled to an inner surface of the first orthosis layer, the second orthosis layer configured to be coupled to a surface electrode, the first orthosis layer and the second orthosis layer collectively configured such that the surface electrode is disposed at a predetermined position overlying a peroneal nerve of the limb when the first orthosis layer and the second orthosis layer are disposed about the portion of the limb; and

    a connector assembly configured to electrically couple the electrical stimulator to the surface electrode, at least a portion of the connector assembly configured to be disposed within a connector opening defined by at least one of the first orthosis layer or the second orthosis layer.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×