Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures

• US 8,702,956 B2
• Filed: 01/23/2012
• Issued: 04/22/2014
• Est. Priority Date: 12/31/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Frodis, Uri, Cohen, Adam L., Lockard, Michael S.
• Primary Examiner(s): Hendricks, Keith
• Assistant Examiner(s): Sherrill, Stefanie
• Application Number:
  US13/356,398
• Publication Number:
  US 20120181180A1
• Time in Patent Office: 820 Days
• Field of Search: 205/222
• US Class Current: 205/222
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00492 Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484
• CPC Class Codes: B81C 2201/0104 Chemical-mechanical polishing [CMP]
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 99/0065 Process control; Yield prediction
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/48 After-treatment of electroplated surfaces
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Claims

1. A fabrication process for forming a multi-layer three-dimensional structure from a first layer formed on and adhered to a substrate and from at least one successive layer with each successive layer formed on and adhered to a planarized surface of a last formed layer and wherein each layer includes a plurality of planarized deposited materials, comprising:

(a) forming and adhering a layer on a substrate and forming and adhering a layer to a previously formed layer, wherein a given layer comprises desired patterns of at least two deposited materials, wherein one or more contact pads exist on the substrate or on a previously formed layer;

(b) subjecting the at least two deposited materials of the given layer to a planarization operation without subjecting the one or more contact pads to planarization, comprising;

(i) mounting the substrate to a fixture in a fly cutting machine;

(ii) while the substrate is mounted to the fixture, subjecting the at least two deposited materials to a rotating cutting tool to planarize a surface of the at least two deposited materials for the given layer and to bring the height of the at least two deposited materials for the given layer to a reduced level;

(c) after the planarization operation, locating a measurement device in contact with the one or more contact pads;

(d) after the planarization operation, locating the measurement device in contact with one or more points on at least one of the at least two deposited materials for the given layer that were subject to the planarization operation;

(e) extracting data from the measurement device concerning a measured height of planarized material of at least one point relative to a desired reference point or plane based on the one or more contact pads;

(f) comparing the measured height of the at least two planarized materials for the given layer to a desired height for the given layer;

(g) if the measured and desired heights are not within a desired tolerance, repeating operations (b)-(f) until the measured and desired heights are within the desired tolerance;

(h) repeating the forming and adhering of a layer to a previously formed layer of operation (a) one or more times to form the multi-layer three-dimensional structure from a plurality of adhered layers.

2. The process of claim 1 wherein forming and adhering of the layer of material involves a selective deposition of a first material and a blanket deposition of a second material.

3. The process claim 1 wherein forming and adhering of the layer of material involves a selective deposition of a first material, a blanket deposition of a second material and wherein at least one of the first or second materials is deposited via an electroplating operation.

4. The process of claim 1 wherein the planarization operation includes a lapping operation.

5. The process of claim 1 wherein the planarization operation includes a diamond machining operation.

6. A fabrication process for forming a multi-layer three-dimensional structure from a first layer formed on and adhered to a substrate and from at least one successive layer with each successive layer formed on and adhered to a planarized surface of a last formed layer and wherein each layer includes a plurality of planarized deposited materials, comprising:

(a) forming and adhering a layer on a substrate and forming and adhering a layer to a previously formed layer, wherein a given layer comprises desired patterns of at least two deposited materials, wherein one or more contact pads exist on the substrate or a previously formed layer;

(b) subjecting the at least two deposited materials of the given layer to a planarization operation without subjecting the one or more contact pads to planarization;

(c) after the planarization operation, locating a measurement probe in contact with the one or more contact pads;

(d) after the planarization operation, locating the measurement probe in contact with one or more points on at least one of the at least two deposited materials that were subject to the planarization operation;

(e) extracting data from the measurement probe concerning a measured height of the at least two planarized materials for the given layer relative to a desired reference point or plane based on the at least one or more contact pads;

(f) comparing the measured height of the at least two planarized materials for the given layer to a desired height for the given layer;

(g) if the measured and desired heights are not within a desired tolerance, repeating operations (b)-(f) until the measured and desired heights are within the desired tolerance;

(h) repeating the forming and adhering of a layer to a previously formed layer of operation (a) one or more times to form the multi-layer three-dimensional structure from a plurality of adhered layers.

7. The process of claim 6 wherein the one or more contact pads comprise at least three contact pads.

8. The process of claim 6 wherein the measurement probe comprises at least three fixed length standoffs and at least one moveable probe.

9. The process of claim 8 wherein the at least one moveable probe comprises at least three moveable probes.

10. The process of claim 8 wherein the at least one moveable probe comprises at least four moveable probes.

11. The process of claim 8 wherein the one or more contact pads comprise at least three contact pads, and wherein the locating of steps (c) and (d) comprise locating the at least three fixed length standoffs on the at least three contact pads and locating the at least one moveable probe to the one or more points on the deposited material that was subject to the planarization operation.

12. The process of claim 8 wherein the locating of steps (c) and (d) comprise locating the at least three fixed length standoffs to at least three points on the deposited material that was subject to the planarization operation and locating the at least one moveable probe to the one or more contact pads.

13. The process of claim 6 wherein forming and adhering of the layer of material involves a selective deposition of a first material and a blanket deposition of a second material.

14. The process of claim 6 wherein forming and adhering of the layer of material involves a selective deposition of a first material, a blanket deposition of a second material and wherein at least one of the first or second materials is deposited via an electroplating operation.

15. The process of claim 6 wherein the planarization operation includes a lapping operation.

16. The process of claim 6 wherein the planarization operation includes a diamond machining operation.