Spectrally efficient photodiode for backside illuminated sensor

• US 8,704,277 B2
• Filed: 01/18/2007
• Issued: 04/22/2014
• Est. Priority Date: 05/09/2006
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hsu, Tzu-Hsuan, Yaung, Dun-Nian
• Primary Examiner(s): Weiss, Howard
• Assistant Examiner(s): SKYLES, TIFNEY L
• Application Number:
  US11/624,568
• Publication Number:
  US 20070262354A1
• Time in Patent Office: 2,651 Days
• Field of Search: 257/292, 257/228
• US Class Current: 257/228
• CPC Class Codes: H01L 27/14603 Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14645 Colour imagers

Abstract

A backside illuminated sensor includes a semiconductor substrate having a front surface and a back surface and a plurality of pixels formed on the front surface of the semiconductor substrate. A dielectric layer is disposed above the front surface of the semiconductor substrate. The sensor further includes a plurality of array regions arranged according to the plurality of pixels. At least two of the array regions have a different radiation response characteristic from each other, such as the first array region having a greater junction depth than the second array region, or the first array region having a greater dopant concentration than the second array region.

Claims

1. A backside illuminated sensor, comprising:

a semiconductor substrate having a front surface and a back surface;

a plurality of pixels formed on the front surface of the semiconductor substrate, wherein the plurality of pixels includes a first, second, and third pixel disposed at the front surface of the semiconductor substrate;

a dielectric layer disposed above the front surface of the semiconductor substrate;

a plurality of array regions arranged according to the plurality of pixels, wherein the plurality of array regions includes a first, second, and third array; and

a plurality of color filters formed over the back surface, each being aligned with one of the plurality of pixels, and

wherein the first array extends a first depth in a direction of the back surface, the second array extends a second depth in the direction of the back surface, the third array extends a third depth in the direction of the back surface,

wherein the second depth extends deeper in the direction of the back surface of the substrate than first depth and the third depth extends deeper in the direction of the back surface than the second depth.

2. The sensor of claim 1, wherein the first array region has a greater dopant concentration than the second array region.

3. The sensor of claim 1, wherein the plurality of pixels are of a type to form a CMOS image sensor.

4. The sensor of claim 1, wherein the plurality of pixels are of a type to form a charge-coupled device.

5. The sensor of claim 1, wherein the plurality of pixels are of a type to form an active-pixel sensor.

6. The sensor of claim 1, wherein the plurality of pixels are of a type to form a passive-pixel sensor.

7. The sensor of claim 1, wherein the dielectric layer comprises a low-k material.

8. The sensor of claim 1, wherein the dielectric layer comprises silicon oxide.

9. The sensor of claim 8, wherein the silicon oxide is carbon-doped.

10. The sensor of claim 8, wherein the silicon oxide is fluorine-doped.

11. The sensor of claim 1 further comprising:

a plurality of metal layers over the substrate.

12. The sensor of claim 1, wherein the plurality of color filters includes:

a red color filter disposed over the back surface of the semiconductor substrate, the red color filter aligned with the first pixel;

a green color filter disposed over the back surface of the semiconductor substrate, the green color filter aligned with the second pixel; and

a blue color filter disposed over the back surface of the semiconductor substrate, the blue color filter aligned with the third pixel.

13. A backside illuminated sensor, comprising:

a first, second, and third pixel having a first, second, and third doping region, respectively;

a semiconductor substrate having a front side and a back side, the first, second, and third pixels formed at the front side of the semiconductor substrate;

a first, second, and third color filter formed over the back side of the semiconductor substrate, the first, second, and third color filter aligned with the first, second, and third pixel, respectively;

wherein the first doping region is spaced a first distance from the first color filter, the second doping region is spaced a second distance from the second color filter, the third doping region is spaced a third distance from the third color filter,

wherein the first doping region extends a first depth in a direction of the back side, the second doping region extends a second depth in the direction of the back side, the third doping region extends a third depth in the direction of the back side, and

wherein the second depth extends deeper in the direction of the back side of the substrate than first depth and the third depth extends deeper in the direction of the back side than the second depth.

14. The sensor of claim 13, wherein the first color filter is configured to filter a wavelength of red light, the second color filter is configured to filter a wavelength of green light, and the third color filter is configured to filter a wavelength of blue light.

15. The sensor of claim 13, wherein the first distance is greater than second distance and the second distance is greater than the third distance.

16. The sensor of claim 13, wherein the first, second, and third doping regions have a doping concentration from approximately 10¹⁴ atoms/cm³ to approximately 10²¹ atoms/cm³.

17. The sensor of claim 13, wherein the first, second, and third distances enable the first, second, and third doping regions to be configured so that a uniform spectral response is achieved by the first, second, and third pixels.

18. A backside illuminated sensor, comprising:

a semiconductor substrate having a front surface and a back surface;

a first, second, and third pixel disposed at the front surface of the semiconductor substrate, the first, second, and third pixel having a first, second, and third doping region, respectively;

a red color filter disposed over the back surface of the semiconductor substrate, the red color filter aligned with the first pixel;

a green color filter disposed over the back surface of the semiconductor substrate, the green color filter aligned with the second pixel; and

a blue color filter disposed over the back surface of the semiconductor substrate, the blue color filter aligned with the third pixel;

wherein the first doping region extends a first depth in a direction of the back surface, the second doping extends a second depth in the direction of the back surface, the third doping region extends a third depth in the direction of the back surface,

wherein the second depth extends deeper in the direction of the back surface of the substrate than first depth and the third depth extends deeper in the direction of the back surface than the second depth.

19. The sensor of claim 18, wherein the first depth is less than 0.5 μ

m, the second depth is less than 1.0 μ

m, and the third depth is less than 1.5 μ

m.

20. The sensor of claim 18, wherein the first, second, and third doping regions are formed to possess a different doping concentration from each other.