Power surface mount light emitting die package

• US 8,710,514 B2
• Filed: 05/25/2012
• Issued: 04/29/2014
• Est. Priority Date: 09/04/2002
• Status: Expired due to Term

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter Scott, Loh, Ban P.
• Primary Examiner(s): MONTALVO, EVA Y
• Application Number:
  US13/481,334
• Publication Number:
  US 20120235199A1
• Time in Patent Office: 704 Days
• Field of Search: 257/98, 257/99, 257/100, 257/81, 257/691, 257/700, 257/706, 257/680, 257/E33.056
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

Claims

1. A light emitting die package, comprising:

a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface;

a via hole through the substrate, wherein a surface of the via hole is at least partially coated with an insulating film;

a conductive lead extending from the first surface to the second surface through the via hole; and

a conductive trace on the top surface of the substrate, the conductive trace comprising electrically conductive material and configured to electrically connect to an LED, the conductive trace extending to the side edge of the substrate; and

a reflector attached to the top surface of the substrate, the reflector leaving portions of the top surface of the substrate and portions of the conductive trace that extend to the side edge of the substrate exposed.

2. The package of claim 1, further comprising a mounting pad for mounting the LED, the reflector plate coupled to the substrate and substantially surrounding the mounting pad.

3. The package of claim 2, wherein the reflector comprises at least one leg mechanically engaging the substrate for increased thermal transfer.

4. The package of claim 2, wherein the substrate comprises flanges along at least one side for mechanically engaging the reflector.

5. The package of claim 2, wherein the reflector comprises a material having high thermal conductivity.

6. The package of claim 2 further comprising a lens substantially covering the mounting pad.

7. The package of claim 6, wherein the lens comprises a trough adapted to receive optical chemicals.

8. The package of claim 6, wherein the lens comprises materials selected from the group consisting of frequency shifting compounds, a diffusant, and a phosphor.

9. A light emitting die package, comprising:

a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface;

a first conductive trace and a second conductive trace disposed on the first surface, which are insulated from the substrate by a first insulating film, the first conductive trace forming a mounting pad for mounting a light emitting device and extending from the mounting pad to the side edge of the substrate;

a light emitting diode (LED) mounted on the substrate and connected to the first and second conductive traces, wherein the LED is encapsulated within optically clear polymer;

a thermal contact pad disposed on the second surface of the substrate opposing the first conductive trace; and

at least one via hole formed through the substrate, wherein the via hole is spaced apart from the thermal contact pad.

10. The package of claim 9, wherein the at least one via hole comprises a conductive trace therethrough, the conductive trace being insulated from the substrate by a second insulating film and being in electrical contact with one of the first and second conductive traces.

11. The package of claim 9, wherein the first insulating film comprises a ceramic polymer film.

12. The package of claim 9, wherein the substrate comprises one of a ceramic or a metal selected from the group consisting of copper, aluminum and a copper/aluminum alloy.

13. The package of claim 9, wherein one of the first and second traces extends around the side edge of the substrate.

14. The package of claim 9, wherein a reflector is coupled to the substrate and substantially surrounding the mounting pad.

15. The package of claim 14, wherein the reflector comprises at least one leg mechanically engaging the substrate for increased thermal transfer.

16. The package of claim 14, wherein the substrate comprises flanges along at least one side for mechanically engaging the reflector.

17. The package of claim 15, wherein the reflector comprises a material having high thermal conductivity.

18. The package of claim 9, further comprising a lens substantially covering the LED.

19. The package of claim 18, wherein the lens comprises a trough adapted to receive optical chemicals.

20. The package of claim 18, wherein the lens comprises materials selected from the group consisting of frequency shifting compounds, a diffusant, and a phosphor.

21. The package of claim 9 wherein the substrate comprises a material which is both thermally conductive and electrically conductive.

22. A light emitting die package, comprising:

a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface;

a first conductive trace on the first surface that is insulated from the substrate by a ceramic polymer film, the first conductive trace forming a mounting pad for mounting a light emitting device and extending from the mounting pad to the side edge of the substrate; and

a reflector attached to the first surface of the substrate, the reflector leaving portions of the first conductive trace that extend to the side edge of the substrate exposed.

23. The package of claim 22, further comprising a second conductive trace, and a light emitting diode (LED) mounted on the substrate and connected to the first and second conductive traces.

24. The package of claim 23, further comprising at least one via hole formed through the substrate that comprises a conductive trace therethrough, the conductive trace being insulated from the substrate by a second insulating film and being in electrical contact with one of the first and second conductive traces.

25. The package of claim 23, further comprising a second conductive trace electrically connected to the first conductive trace, wherein one of the first and second traces extends around the side edge of the substrate.

26. The package of claim 22, further comprising a mounting pad for mounting a light emitting diode (LED), the reflector coupled to the substrate and substantially surrounding the mounting pad.

27. A light emitting die package, comprising:

a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface;

a first conductive trace on the first surface that is insulated from the substrate by a ceramic polymer film, the first conductive trace forming a mounting pad for mounting a light emitting device and extending from the mounting pad to the side edge of the substrate; and

a reflective surface disposed on the first surface of the substrate at least partially on top of the first conductive trace, the reflective surface leaving portions of the first conductive trace that extend to the side edge of the substrate exposed.

28. The package of claim 27, further comprising a second conductive trace, and a light emitting diode mounted on the substrate and connected to the first and second conductive traces.

29. The package of claim 28, further comprising at least one via hole formed through the substrate that comprises a conductive trace therethrough, the conductive trace being insulated from the substrate by a second insulating film and being in electrical contact with one of the first and second conductive traces.

30. The package of claim 27, further comprising a mounting pad for mounting a light emitting diode, the reflective surface coupled to the substrate and substantially surrounding the mounting pad.