Light emitting device with plurality of LED chips and/or electrode wiring pattern

  • US 8,723,195 B2
  • Filed: 03/13/2013
  • Issued: 05/13/2014
  • Est. Priority Date: 01/22/2010
  • Status: Active Grant
First Claim
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1. A light emitting device comprising:

  • a substrate having a rectangular outer shape in a top view;

    a plurality of LED chips positioned around a center of a primary surface of the substrate;

    a resin frame formed on the primary surface of said substrate and provided annularly so as to surround a mounting area in which said plurality of LED chips are provided;

    an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device, the anode-side electrode land and the cathode-side electrode land being provided outside said resin frame and near corners of the primary surface of the substrate,an electrode wiring pattern formed on the primary surface of said substrate including (i) an anode line extending from said anode-side electrode land to a portion under said resin frame and (ii) a cathode line extending from said cathode-side electrode land to the other portion under said resin frame, so as to electrically connect the plurality of LED chips to the anode-side electrode land and the cathode-side electrode land; and

    wherein the resin frame is made of resin that has light reflectivity.

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