Methods of creating probe structures from a plurality of planar layers

• US 8,723,543 B2
• Filed: 10/14/2011
• Issued: 05/13/2014
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Chen, Richard T., Kruglick, Ezekiel J. J., Bang, Christopher A., Smalley, Dennis R., Lembrikov, Pavel B.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US13/273,873
• Publication Number:
  US 20120064227A1
• Time in Patent Office: 942 Days
• Field of Search: None
• US Class Current: 324/755.05
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip, a compliant body, and a bonding material that can be used in bonding the probe to a substrate and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Claims

1. A method of creating a probe structure for contacting an electronic components wherein the probe structure comprises a contact tip for contacting a first electronic component, a body portion that comprises a distal end that joins the contact tip and a proximal end that provides for mounting of the probe structure to a second electronic component wherein a bonding material is provided for attaching the proximal end to the second electronic component, the method comprising:

a) forming at least a portion of the body portion from one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer that forms a portion of the body portion, and wherein the body portion comprises at least one of the at least one structural material;

b) forming a body of a bonding material from one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one bonding material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer that comprises the bonding material; and

c) forming the contact tip from at least a portion of one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer from which the contact tip is formed, and wherein during electrodeposition the contact tip is formed from at least one of the at least one structural material,

d) after forming the body portion, the body of bonding material, and the contact tip from one or more multiple materials layers, releasing the at least one structural material from the at least one sacrificial material to reveal the probe structure,

wherein any successive multiple material layer or layers are formed and simultaneously adhered to a previously formed multiple material layer, and wherein forming of the body portion, the body of bonding material, and the contact tip may occur during formation of the same multi-material layer or layers or different multi-material layers.

2. The method of claim 1 wherein the body portion provides for elastic compression of the probe structure in a plane of primary motion when making contact with a first electronic component and wherein during formation of the probe structure, a stacking direction of layers forming the probe structure is perpendicular to the plane of primary motion.

3. The method of claim 1 wherein the at least one structural material forming the body portion of the probe structure comprises at least one material that is different from the at least one structural material forming the contact tip.

4. The method of claim 1 wherein a material forming a contact portion of the contact tip is different from any material forming the body portion.

5. The method of claim 1 wherein the probe structure comprises a cantilever probe.

6. The method of claim 5 wherein the proximal end comprises an extended base portion that extends at least partway under a cantilever element of the cantilever probe, wherein the extended base portion provides for contacting the second electronic component and wherein the bonding material and extended base portion are formed in at least partial contact.

7. The method of claim 5 wherein a cantilever element of the cantilever probe comprises a plurality of beam elements wherein at least part of each of the plurality of beam elements are formed within a single multi-material layer.

8. The method of claim 5 wherein the cantilever probe comprises a configuration including a primary beam and at least one additional beam that joins the primary beam and connects to the elongated base via a support element that is different from a support element that connects the primary beam to the elongated base.

9. The method of claim 1 wherein the method of creating a probe structure simultaneously creates a plurality of probe structures in a batch process on a build substrate over which a release layer is formed and onto which the one or more multiple material layers are formed.

10. The method of claim 9 wherein the plurality of probe structures are attached to the second electronic component after release from the build substrate, in a desired configuration and wherein the contact tips are made to at least temporarily contact the first electronic component to provide an electrical connection between the first and second electronic components.

11. The method of claim 1 wherein the one or more multi-material layers from which the body portion is formed comprise a plurality of layers and wherein the at least one multiple material layers from which the contact tip is formed also form at least part of the body portion.

12. The method of claim 11 wherein at least one multiple material layer from which at least a portion of the body of bonding material is formed is a different multiple material layer than that from which the body portion is formed.

13. The method of claim 11 wherein at least one multiple material layer from which at least a portion of the body of bonding material formed is a different multi-material layer than that from which the contact tip is formed.

14. The method of claim 1 wherein the bonding material comprises solder.

15. A method of creating a probe structure for contacting an electronic components wherein the probe structure comprises a contact tip for contacting a first electronic component, a body portion that comprises a distal end that joins the contact tip and a proximal end for mounting to a second electronic component wherein a bonding material is provided for attaching the proximal end to a second electronic component, the method comprising:

a) forming at least part of the body portion;

b) forming at body of the bonding material; and

c) forming the contact tip;

wherein the formation of each of the body portion, the body of bonding material, and the contact tip comprise forming one or more multiple material layers of deposited material, wherein for each of the one or more multiple material layers at least one of the multiple materials is at least one structural material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein for each of the one or more multiple material layers at least a plurality of the multiple materials are planarized to set a boundary level for each multiple material layer, wherein the body portion, the body of bonding material, and the contact tip, are each formed from at least one structural material deposited during the formation of at least one multiple material layer

wherein any successive multiple material layer or layers are successively formed and adhered to a previously formed multiple material layer, and wherein forming of the body portion, the body of bonding material, and the contact tip may occur during formation of the same multi-material layer or layers or different multi-material layers, and

d) after forming the body portion, the body of bonding material, and the contact tip, releasing the at least one structural material from the at least one sacrificial material to reveal the probe structure.

16. The method of claim 15 wherein the body portion provides for elastic compression of the probe structure in a plane of primary motion when making contact with a first electronic component and wherein during formation of the probe structure, a stacking direction of layers forming the probe structure is perpendicular to the plane of primary motion.

17. The method of claim 15 wherein the at least one structural material forming the body portion of the probe structure comprises at least one material that is different from at least one structural material forming the contact tip.

18. The method of claim 15 wherein a material forming a contact portion of the contact tip is different from any material forming the body portion.

19. The method of claim 15 wherein the probe structure comprises a cantilever probe.

20. The method of claim 19 wherein a cantilever element of the cantilever probe comprises a plurality of beam elements wherein at least part of each of the plurality of beam elements are formed within a single multi-material layer.

21. The method of claim 19 wherein the proximal end comprises an extended base portion, extending at least part way under a cantilever element of the cantilever probe, wherein the extended base provides for contacting the second electronic component and wherein the bonding material and the extended base portion are formed in at least partial contact.

22. The method of claim 19 wherein the cantilever probe comprises a configuration including a primary beam and at least one additional beam that joins the primary beam and connects to an elongated base via a support element that is different from a support element that connects the primary beam to the elongated base.

23. The method of claim 15 wherein the method of creating a probe structure simultaneously creates a plurality of probe structures in a batch process on a build substrate over which a release layer is formed and onto which the one or more multiple material layers are formed.

24. The method of claim 23 wherein the plurality of probe structures are attached to the second electronic component, after being released from the build substrate, in a desired configuration and wherein the contact tips are made to at least temporarily contact the first electronic component to provide an electrical connection between the first and second electronic components.

25. The method of claim 15 wherein the one or more multi-material layers from which the probe structure comprises a plurality of multi-material layers and wherein the contact tip is formed from at least one multi-material layer that also forms a portion of the compliant body.

26. The method of claim 15 wherein at least one multiple material layer from which at least a portion of the body of bonding material is formed different from the at least one multiple material layer from which the body portion is formed.

27. The method of claim 15 wherein at least one multiple material layer from which at least a portion of the body of bonding material is formed is different from at least one multiple material layer from which the contact tip is formed.

28. The method of claim 15 wherein the bonding material comprises solder.

29. The method of claim 15 wherein the deposited material is deposited via a process selected from the group consisting of (1) electroplating;

(2) electroless plating;

(3) PVD, (4) CVD, (5) sputtering, (6) spray metal deposition, (7) deposition via ink.