Circuit module and manufacturing method for the same

• US 8,724,334 B2
• Filed: 07/12/2012
• Issued: 05/13/2014
• Est. Priority Date: 08/19/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Nishikawa, Hiroshi, Fujita, Makoto, Kawahara, Fumikiyo
• Primary Examiner(s): Vo, Peter DungBa
• Assistant Examiner(s): PARVEZ, AZM A
• Application Number:
  US13/547,085
• Publication Number:
  US 20120281370A1
• Time in Patent Office: 670 Days
• Field of Search: 298/41, 298/32, 298/29, 298/25, 295/921, 294/12, 294/16, 361/748, 361/818, 361/816, 361/679.01, 361/600
• US Class Current: 361/748
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/095 : for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2203/025 : Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/0044 : Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/381 : by special treatment of the substrate
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49151 : by deforming or shaping
• CPC Class Codes: Y10T 29/49789 : Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Claims

1. A circuit module comprising:

a board;

a plurality of electronic components mounted on a principal surface of the board;

an insulator layer covering the principal surface of the board and the electronic components, the insulator layer including uneven portions in an upper principal surface thereof; and

a shield layer disposed on the upper principal surface of the insulator layer, on lateral surfaces of the insulator layer located on opposite ends of the upper principal surface of the insulator layer, and on lateral surfaces of the board located on opposite ends of the principal surface of the board that correspond to the opposite ends of the upper principal surface of the insulator layer, and being made of an electrically conductive resin;

wherein

the uneven portions are defined by;

at least one groove provided in the upper principal surface of the insulator layer and extending towards a lower principal surface of the insulator layer but not entirely through the insulating layer to the lower principal surface; and

at least one projection provided in the upper principal surface of the insulator layer and extending away from the lower principal surface of the insulator layer; and

at least one of the at least one groove and at least one of the at least one projection are disposed directly over at least one of the plurality of electronic components.

2. The circuit module according to claim 1, wherein a plurality of the grooves and a plurality of the projections are provided and arranged at predetermined intervals.

3. The circuit module according to claim 1, wherein a principal surface of the shield layer includes uneven portions that is in conformity with the uneven portions in the principal surface of the insulator layer.

4. The circuit module according to claim 1, wherein at least one of the lateral surfaces of the board includes a step provided therein, and the shield layer is disposed on the step of the at least one of the lateral surfaces of the board.