Method of manufacturing a lighting assembly with thermal overmolding
First Claim
1. A method of manufacturing a lighting assembly, the method comprising:
- locating one or more light emitting diodes (LEDs) on a printed circuit board;
electrically and mechanically connecting the printed circuit board to a plurality of flexible electrical conductors;
disposing one or more light-transmissive covers over said one or more LEDs;
placing the circuit board with attached LEDs and flexible electrical conductors in a mold, said mold including one or more isolation regions associated with the one or more LEDs and one or more light-transmissive covers; and
insert molding an overmolding material over at least portions of the printed circuit board proximate the LEDs;
wherein the one or more isolation regions prevent an at least one aperture and a portion of the light-transmissive cover over the LEDs from being covered with overmolding material.
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0 Petitions
Accused Products
Abstract
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
36 Citations
9 Claims
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1. A method of manufacturing a lighting assembly, the method comprising:
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locating one or more light emitting diodes (LEDs) on a printed circuit board; electrically and mechanically connecting the printed circuit board to a plurality of flexible electrical conductors; disposing one or more light-transmissive covers over said one or more LEDs; placing the circuit board with attached LEDs and flexible electrical conductors in a mold, said mold including one or more isolation regions associated with the one or more LEDs and one or more light-transmissive covers; and insert molding an overmolding material over at least portions of the printed circuit board proximate the LEDs; wherein the one or more isolation regions prevent an at least one aperture and a portion of the light-transmissive cover over the LEDs from being covered with overmolding material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification