Semiconductor device and programming method

• US 8,772,953 B2
• Filed: 03/13/2009
• Issued: 07/08/2014
• Est. Priority Date: 01/17/2006
• Status: Expired due to Fees

• Current Assignee: Monterey Research, LLC (Vector Capital Corporation)
• Original Assignee: Spansion LLC (Infineon Technologies AG)
• Inventors: Taya, Koji, Onodera, Masanori, Tanaka, Junji, Meguro, Kouichi
• Primary Examiner(s): Such, Matthew W
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US12/404,146
• Publication Number:
  US 20090174057A1
• Time in Patent Office: 1,943 Days
• Field of Search: 257/790, 257/E23.123, 257/686, 438/124
• US Class Current: 257/790
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 23/28 Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

Claims

1. A method for fabricating a semiconductor device comprising:

mounting a semiconductor chip on a chip mounting portion;

coupling a wire between the semiconductor chip and the chip mounting portion

disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and

forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip, wherein the wire is provided in contact with the sheet-shaped resin portion.

2. The method as claimed in claim 1, wherein disposing the sheet-shaped resin includes disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip.

3. The method as claimed in claim 2, wherein forming the resin sealing portion includes:

disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and

sealing the semiconductor chip by the uncured resin.

4. The method as claimed in claim 1, wherein forming the resin sealing portion is forming the resin sealing portion by transfer molding.

5. The method as claimed in claim 1, wherein the sheet-shaped resin does not include a filler.

6. The method as claimed in claim 1, wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.

7. The method as claimed in claim 1, wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.

8. The method as claimed in claim 1, wherein the semiconductor chip has stacked semiconductor chips.

9. The method as claimed in claim 1 wherein the wire is partially embedded in the sheet-shaped resin portion.

10. A wireless communications device, comprising:

a memory comprising;

a semiconductor chip;

a chip mounting portion mounting the semiconductor chip;

a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;

a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion;

a processor;

a communications component;

a transmitter;

a receiver; and

an antenna connected to the transmitter circuit and the receiver circuit.

11. The wireless communications device of claim 10, wherein said memory is NAND flash memory.

12. The wireless communications device of claim 10, wherein said memory is NOR flash memory.

13. The wireless communications device of claim 10, wherein said memory comprises at least one memory cell operable to store more than one bit.

14. The wireless communications device of claim 10, wherein the wire is partially embedded in the sheet-shaped resin portion.

15. A computing device comprising:

a processor;

an input component;

an output component;

a memory comprising;

a semiconductor chip;

a chip mounting portion mounting the semiconductor chip;

a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;

a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.

16. The computing device of claim 15, wherein said computing device is a personal computer (PC).

17. The computing device of claim 15, wherein said computing device is a personal digital assistant (PDA).

18. The computing device of claim 15, wherein said computing device is a gaming system.

19. The computing device of claim 15, wherein the wire is partially embedded in the sheet-shaped resin portion.

20. A portable media player comprising:

a processor;

a cache;

a user input component;

a coder-decoder component; and

a memory comprising;

a semiconductor chip;

a chip mounting portion mounting the semiconductor chip;

a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;

a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.

21. The portable media player of claim 20, wherein said portable media player is a portable music player.

22. The portable media player of claim 20, wherein said portable media player is a portable video player.

23. The portable media player of claim 20, wherein said memory comprises:

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.

24. The portable media player of claim 20, wherein the wire is partially embedded in the sheet-shaped resin portion.