×

System and method for providing even heat distribution and cooling return pads

  • US 8,777,940 B2
  • Filed: 04/03/2007
  • Issued: 07/15/2014
  • Est. Priority Date: 04/03/2007
  • Status: Active Grant
First Claim
Patent Images

1. A return pad for use with an electrosurgical system, comprising:

  • a conductive layer;

    a contact layer configured to engage patient skin; and

    an intermediate layer disposed between the conductive layer and the contact layer, the intermediate layer uniformly covering a substantial portion of the contact layer thereby forming a low impedance connection with the conductive layer and the contact layer and configured to pass electrical current therethrough, the intermediate layer further adapted to distribute current flow between the contact layer and the conductive layer.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×