×

Glass substrate for magnetic disk and manufacturing method of the same

  • US 8,783,063 B2
  • Filed: 01/12/2012
  • Issued: 07/22/2014
  • Est. Priority Date: 09/28/2007
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing a glass substrate for a magnetic disk,wherein the glass contains in expression of percent by mass:

  • SiO2 57 to 75%;

    Al2O3 5 to 20%;

    (where the total amount of SiO2+Al2O3 is 74% or more)the total of ZrO2, HfO2, Nb2O5, Ta2O5, La2O3, Y2O3, and TiO2 exceeding 0% to 6% or less;

    Li2O exceeding 1% to 9% or less;

    Na2O 5 to 18%;

    (where the mass ratio Li2O/Na2O is 0.5 or less)K2O 0 to 6%;

    MgO 0 to 4%;

    CaO exceeding 0% to 5% or less;

    (where the total amount of MgO and CaO is 5% or less, and the content of CaO is higher than the content of MgO) andSrO+BaO 0 to 3%,the method comprising the step of applying chemical reinforcement treatment to the glass substrate,wherein a glass composition of the glass substrate and conditions of the chemical reinforcement treatment are selected to perform the chemical reinforcement treatment on the selected conditions so that when the glass substrate for a magnetic disk is made by the chemical reinforcement treatment, a penetration length in an uppermost-portion stress layer on a main surface of the glass substrate for a magnetic disk is 49.1 μ

    m or less, and that assuming that an angle between the main surface and compressive stress in a stress profile by a Babinet compensator method is θ

    , the penetration length in the uppermost-portion stress layer is a value y of {12·



    ln(tan θ

    )+(49.1/t)} or less,the penetration length in the uppermost-portion stress layer is a length of the longer diagonal in an indentation when a diamond quadrangular pyramid indenter of rhombic transverse section with vertex angles of 172°

    30′ and

    130°

    is pressed against the main surface with a pressing force of 100 g, the tan θ

    is a value {(L1+L2)/(P1+P2)} calculated from stress values and stress depths obtained by the Babinet compensator method, the t is a thickness of the substrate,P1 is a compressive stress value, P2 is a tensile stress value, L1 is a compressive stress depth, and L2 is a tensile stress depth.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×