Resin composition for forming receiving layer, and receiving substrate; printed matter, conductive pattern, and electric circuit produced by using the resin composition

• US 8,784,956 B2
• Filed: 08/28/2012
• Issued: 07/22/2014
• Est. Priority Date: 09/09/2011
• Status: Active Grant

• Current Assignee: DIC Corporation
• Original Assignee: DIC Corporation
• Inventors: Saitou, Yukie, Fujikawa, Wataru, Shirakami, Jun
• Primary Examiner(s): Shewareged, Betelhem
• Application Number:
  US13/881,254
• Publication Number:
  US 20130260114A1
• Time in Patent Office: 693 Days
• Field of Search: 428/32.34, 428/423.1, 523/160
• US Class Current: 428/32.34
• CPC Class Codes: B41M 5/52 Macromolecular coatings
• CPC Class Codes: B41M 5/5218 characterised by inorganic additives, e.g. pigments, clays
• CPC Class Codes: B41M 5/5254 characterised by the use of polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• CPC Class Codes: B41M 5/5281 Polyurethanes or polyureas
• CPC Class Codes: C08G 18/10 Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 23/0815 Copolymers of ethene with aliphatic 1-olefins
• CPC Class Codes: C08L 33/12 Homopolymers or copolymers of methyl methacrylate
• CPC Class Codes: C08L 33/26 Homopolymers or copolymers of acrylamide or methacrylamide
• CPC Class Codes: C09D 175/04 Polyurethanes
• CPC Class Codes: H05K 1/0353 consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence
• CPC Class Codes: Y10T 428/24901 including coloring matter
• CPC Class Codes: Y10T 428/31551 Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Abstract

An object to be achieved by the present invention is to provide a resin composition for forming a receiving layer, the resin composition being capable of forming, among receiving layers that can carry a fluid such as an ink, a receiving layer having excellent, adhesion to various types of supports and capable of forming a receiving layer which has excellent printing properties without causing bleeding of a fluid such as an ink. The present invention relates to a resin composition for forming a receiving layer, the resin composition containing a urethane resin (A), a vinyl polymer (B), and an aqueous medium (C), in which the urethane resin (A) has an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg relative to the total amount of the urethane resin (A), and a hydrophilic group.

Claims

1. A printed matter comprising a receiving substrate comprising a support and a receiving layer provided onto part of or an entire surface of the support, wherein the receiving layer is formed by using a resin composition containing a urethane resin (A) having an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg and a hydrophilic group, a vinyl polymer (B), and an aqueous medium (C), wherein the printed matter is produced by performing printing on the receiving layer with a fluid containing a conductive substance or a pigment.

2. The printed matter according to claim 1, wherein the printing is performed by an ink-jet printing method, a screen printing method, a letterpress reverse printing method, or a gravure off-set printing method.

3. The printed matter according to claim 1, wherein in the resin composition, the urethane resin (A) and the vinyl polymer (B) form a composite resin particle (D) constituted by a shell layer composed of the urethane resin (A) and a core layer composed of the vinyl polymer (B).

4. The printed matter according to claim 1, wherein in the resin composition, the vinyl polymer (B) is obtained by polymerizing a vinyl monomer mixture containing 10% to 70% by mass of methyl methacrylate and 10% to 50% by mass of a (meth)acrylic acid alkyl ester having an alkyl group having 2 to 12 carbon atoms.

5. The printed matter according to claim 3, wherein a mass ratio (A)/(B) of the urethane resin (A) and the vinyl polymer (B) that constitute the composite resin particle (D) is in the range of 70/30 to 10/90.

6. The printed matter according to claim 1, wherein in the resin composition, the vinyl resin (B) has a cross-linkable functional group.

7. The printed matter according to claim 6, wherein the cross-linkable functional group is at least one thermally cross-linkable functional group selected from the group consisting of a methylolamide group and alkoxymethylamide groups.

8. The printed matter according to claim 6, wherein the resin composition further comprises a cross-linking agent (E), wherein the cross-linking agent (E) undergoes a cross-linking reaction when heated to 100°

C. or higher.

9. The printed matter according to claim 1, wherein the resin composition further comprises a cross-linking agent (E), wherein the cross-linking agent (E) undergoes a cross-linking reaction when heated to 100°

C. or higher.

10. The printed matter according to claim 9, wherein the cross-linking agent (E) is at least one thermal cross-linking agent (e1-2) selected from the group consisting of melamine compounds, epoxy compounds, oxazoline compounds, carbodiimide compounds, and isocyanate compounds.

11. A method for producing printed matter according to claim 1 comprising:

applying a resin composition onto part of or an entire surface of a support, wherein the resin composition contains a urethane resin (A) having an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg and a hydrophilic group, a vinyl polymer (B), and an aqueous medium (C);

drying the resin composition under a condition in which the resin composition does not undergo a cross-linking reaction to form a receiving layer;

performing printing on a surface of the receiving layer with a fluid containing a conductive substance or a pigment.

12. The method according to claim 11, further comprising heating the receiving layer on which the printing has been performed to form a cross-linked structure.

13. A method for producing a conductive pattern comprising:

applying a resin composition onto part of or an entire surface of a support, wherein the resin composition contains a urethane resin (A) having an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg and a hydrophilic group, a vinyl polymer (B), and an aqueous medium (C);

drying the resin composition under a condition in which the resin composition does not undergo a cross-linking reaction to form a receiving layer;

performing printing on a surface of the receiving layer with a fluid containing a conductive substance or a pigment to form a printed portion composed of the conductive substance contained in the fluid;

heating the receiving layer on which the printing has been performed to form a cross-linked structure; and

then plating the printed portion formed on the surface of the receiving layer.

14. A conductive pattern comprising a receiving substrate comprising a support and a receiving layer provided onto part of or an entire surface of the support, wherein the receiving layer is formed by using a resin composition containing a urethane resin (A) having an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg and a hydrophilic group, a vinyl polymer (B), and an aqueous medium (C), wherein the conductive pattern is produced by performing printing on the receiving layer with a fluid composed of a conductive ink containing a conductive substance, or a plating nucleus agent containing a conductive substance.

15. The conductive pattern according to claim 14, wherein printing on the receiving layer is followed by forming a cross-linked structure in the receiving layer on which the printing has been performed.

16. The conductive pattern according to claim 14, wherein the conductive pattern is produced by additionally performing an electrolytic plating process or an electroless plating process on a surface of a printed portion formed by printing with the fluid.

17. An electrically conductive circuit comprising the conductive pattern according to claim 14.