Method of making wafer structure for backside illuminated color image sensor

  • US 8,790,954 B2
  • Filed: 08/30/2013
  • Issued: 07/29/2014
  • Est. Priority Date: 05/09/2006
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • providing a semiconductor substrate having a substantially planar front surface and a back surface;

    forming a first pixel and a second pixel on the substantially planar front surface of the semiconductor substrate; and

    forming a first portion of the semiconductor substrate having a first thickness and a second portion of the semiconductor substrate having a second thickness, wherein the first portion having the first thickness is aligned with the first pixel and the second portion having the second thickness is aligned with the second pixel.

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