Method for manufacturing chemical sensor with multiple sensor cells

• US 8,802,568 B2
• Filed: 09/27/2012
• Issued: 08/12/2014
• Est. Priority Date: 09/27/2012
• Status: Active Grant

• Current Assignee: Sensirion AG (Sensirion Holding AG)
• Original Assignee: Sensirion AG (Sensirion Holding AG)
• Inventors: Mayer, Felix, Graf, Markus, Burgi, Lukas
• Primary Examiner(s): Reames, Matthew
• Assistant Examiner(s): NGUYEN, DILINH P
• Application Number:
  US13/628,719
• Publication Number:
  US 20140084390A1
• Time in Patent Office: 684 Days
• Field of Search: 438/48, 438/49, 438/633, 438/689, 438/691
• US Class Current: 438/689
• CPC Class Codes: G01N 27/128 Microapparatus
• CPC Class Codes: G01N 33/0031 comprising two or more sensors, e.g. a sensor array electrochemical electrode arrays G01N27/27
• CPC Class Codes: H01L 29/66 Types of semiconductor device ; Multistep manufacturing processes therefor
• CPC Class Codes: H01L 29/66007 Multistep manufacturing processes

Abstract

In a method for manufacturing a chemical sensor with multiple sensor cells, a substrate is provided and an expansion inhibitor is applied to the substrate for preventing a sensitive material to be applied to an area on the substrate for building a sensitive film of a sensor cell to expand from said area. The sensitive material is provided and the sensitive film is built by contactless dispensing the sensitive material to said area.

Claims

1. Method for manufacturing a chemical sensor with multiple sensor cells, comprising the steps of

providing a substrate,

applying an expansion inhibitor to the substrate for preventing a sensitive material to be applied to an area on the substrate for building a sensitive film of a sensor cell to expand from said area,

providing the sensitive material, and

building the sensitive film by contactless dispensing the sensitive material to said area,

wherein applying the expansion inhibitor includes treating a surface of the substrate for providing a first surface energy in said area, and for providing a second surface energy outside said area, which second surface energy is less than the first surface energy for making said area a preferred zone for the sensitive material to wet to.

2. Method according to claim 1, wherein applying the expansion inhibitor includes applying a barrier at edges of said area for preventing the sensitive material to be applied to said area to escape from said area.

3. Method according to claim 2, herein the barrier includes a rim protruding from the substrate around said area.

4. Method according to claim 2, wherein the barrier includes a recess in the substrate around said area.

5. Method according to claim 1,

wherein the surface of the substrate provides the first surface energy, and

wherein outside said area the surface of the substrate is covered by a coating providing the second surface energy.

6. Method according to claim 1,

wherein the surface of the substrate provides the second surface energy, and

wherein in said area the surface of the substrate is covered by a coating providing the first surface energy.

7. Method according to claim 1, wherein applying the expansion inhibitor includes applying an adhesion film to said area for making the sensitive material to be applied to said area adhere to the adhesion film.

8. Method according to claim 1,

wherein expansion inhibitors are applied to the substrate for preventing the sensitive material to be applied to multiple areas on the substrate for building sensitive films of the multiple sensor cells to expand from said multiple areas, and

wherein the sensitive films are built by contactless dispensing of the sensitive material to said multiple areas.

9. Method according to claim 1,

wherein the sensitive material is jet dispensed to said area on the substrate, and

in particular wherein a defined portion of the sensitive material is jet dispensed to said area on the substrate.

10. Method according to claim 9, wherein the sensitive material is ink jet printed to said area on the substrate.

11. Method according to claim 10, wherein the sensitive material is ink jet printed to multiple areas on the substrate simultaneously, and preferably is ink jet printed to all areas on the substrate simultaneously.

12. Method according to claim 11, wherein the sensitive material is ink jet printed to said multiple areas on the substrate simultaneously through multiple nozzles of a print head.

13. Method according to claim 10, wherein the sensitive material is applied to a first of said multiple areas in a first composition through a first nozzle of a print head, and is applied to a second of said multiple areas in a second composition through a second nozzle of the print head.

14. Method of claim 13, wherein the sensitive material in the first composition and the sensitive material in the second composition are applied simultaneously through the first and the second nozzle respectively.

15. Method according to claim 1, wherein the sensitive material comprises metal oxide nano-particles.

16. Method according to claim 1, wherein the sensitize material comprises polymer material.

17. Method according to claim 1, wherein the sensitive material is dispensed in a liquid phase to said area.

18. Method according to claim 1, wherein applying the expansion inhibitor includes applying an electrode pattern to the substrate, and in particular includes applying an electrode pattern to the substrate that confines said area.

19. Method according to claim 1, wherein the chemical sensor is a chemoresistive sensor containing a metal-oxide semiconductor material.

20. Method according to claim 1,

wherein the substrate has a first thickness in a first region and a second thickness in a second region wherein the first thickness is smaller than the second thickness,

wherein said area is arranged in the first region such that said sensitive material is dispensed in said first region.

21. Method for manufacturing multiple chemical sensors with multiple sensor cells each, comprising the steps of

providing a wafer,

applying expansion inhibitors to the wafer for preventing a sensitive material to be applied to multiple areas on the wafer for building sensitive films of the multiple sensor cells for the chemical sensors to expand from said multiple areas,

providing the sensitive material,

building the sensitive films by contactless dispensing the sensitive material to said multiple areas, and

separating the wafer into the chemical sensors,

wherein applying the expansion inhibitors includes treating a surface of the substrate fir providing a first surface energy in said areas, and for providing a second surface energy outside said areas, which second surface energy is less than the first surface energy for making said areas preferred zones for the sensitive material to wet to.