Method of growing epitaxial layers on a substrate
First Claim
Patent Images
1. An epitaxial growth method, comprising:
- plasma treating a surface of a bulk crystalline Aluminum Nitride (AlN) substrate;
after the plasma treating, removing organics and metals from the surface using one or more chemical etchants;
after removing the organics and metals, heating the surface in an ammonia-rich ambient environment to a temperature of above 1000°
C. for at least 5 minutes without epitaxial growth; and
after heating the surface, epitaxially growing a III-nitride layer on the surface.
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Abstract
An epitaxial growth method includes plasma treating a surface of a bulk crystalline Aluminum Nitride (AlN) substrate and subsequently heating the substrate in an ammonia-rich ambient to a temperature of above 1000° C. for at least 5 minutes without epitaxial growth. After heating the surface, a III-nitride layer is epitaxially grown on the surface.
17 Citations
22 Claims
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1. An epitaxial growth method, comprising:
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plasma treating a surface of a bulk crystalline Aluminum Nitride (AlN) substrate; after the plasma treating, removing organics and metals from the surface using one or more chemical etchants; after removing the organics and metals, heating the surface in an ammonia-rich ambient environment to a temperature of above 1000°
C. for at least 5 minutes without epitaxial growth; andafter heating the surface, epitaxially growing a III-nitride layer on the surface. - View Dependent Claims (2, 3, 4, 10, 11, 12, 13, 14, 15, 16, 17)
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5. An epitaxial growth method, comprising:
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plasma treating a surface of a bulk crystalline Aluminum Nitride (AlN) substrate, wherein plasma treating the surface comprises; accelerating Ar plasma toward the surface; and flowing a halogen-containing gas near the surface during a time that the Ar plasma is accelerated toward the surface; after the plasma treating, removing organics and metals from the surface using one or more chemical etchants; after removing the organics and metals, heating the surface in an ammonia-rich ambient environment to a temperature of above 1000°
C. for at least 5 minutes without epitaxial growth; andafter heating the surface, epitaxially growing a III-nitride layer on the surface. - View Dependent Claims (6, 7, 8, 9)
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18. An epitaxial growth method, comprising:
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plasma treating a surface of a bulk crystalline Aluminum Nitride (AlN) substrate, comprising; accelerating Ar plasma toward the surface; and flowing a halogen-containing gas comprising one or more of chlorine and boron trichloride near the surface during a time that the Ar plasma is accelerated toward the surface; after the plasma treating, removing organics and metals from the surface using one or more chemical etchants; after removing the organics and metals, heating the surface in an ammonia-rich ambient environment to a temperature of above 1000°
C. for at least 5 minutes without epitaxial growth; andafter heating the surface, epitaxially growing an InyAlxGa1-x-yN layer on the surface, wherein 0≦
x≦
1 and 0≦
y≦
1. - View Dependent Claims (19)
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20. An epitaxial growth method, comprising:
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exposing a surface of a bulk crystalline Aluminum Nitride (AlN) substrate to at least one of acetone, methanol, isopropyl alcohol, sulfuric acid, phosphoric acid, nitric acid, and hydrochloric acid; after exposing the surface, plasma treating the surface; after plasma treating the surface, removing organics and metals from the surface using one or more chemical etchants; after removing the organics and metals, heating the surface in an ammonia-rich ambient environment to a temperature of above 1000°
C. for at least 5 minutes without epitaxial growth; andafter heating the surface, epitaxially growing a III-nitride layer on the surface. - View Dependent Claims (21, 22)
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Specification