Light emitting device

• US 8,829,552 B2
• Filed: 06/19/2013
• Issued: 09/09/2014
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Seo, Eun Jung, Cho, Jae Ho, Kim, Bang Hyun
• Primary Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US13/921,556
• Publication Number:
  US 20130277705A1
• Time in Patent Office: 447 Days
• Field of Search: 257/98, 257/99, 257/E33.056
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Claims

1. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first surface, an opposing second surface, and sidewalls arranged between the first surface and the second surface thereof, wherein the first and second lead frames each comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting the first surfaces along three sides of the first and second lead frames;

a light-emitting diode chip arranged on the first surface of the first or second lead frame; and

a resin part disposed in the fixing space to support the first and second lead frames.

2. The light-emitting device of claim 1, wherein the first surface and the second surface of the at least one of the first and second lead frames comprise different surface areas from each other.

3. The light-emitting device of claim 1, wherein the inset sidewalls form a stepped structure.

4. The light-emitting device of claim 1, further comprising a reflector arranged on the first surface of each of the first and second lead frames, the reflector surrounding the light-emitting diode chip.

5. The light-emitting device of claim 1, wherein the resin part comprises a phosphor disposed therein.

6. The light-emitting device of claim 1, wherein at least one sidewall of the first or second lead frame is inclined.

7. The light-emitting device of claim 6, wherein the corresponding first and second surfaces have different surface areas, due to the inclined sidewalls.

8. The light-emitting device of claim 1, wherein the fixing space comprises a fixing hole formed in at least one of the first and second lead frames.

9. The light-emitting device of claim 8, wherein the fixing hole extends through a body of at least one of the first lead frame and the second lead frame.

10. The light-emitting device of claim 8, wherein the sidewalls are inclined.

11. The light-emitting device of claim 8, wherein at least one of the inset sidewalls comprises a concave portion, wherein the concave portion at least partially surrounds the fixing hole.

12. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first surface, an opposing second surface, and sidewalls arranged between the first surface and the second surface thereof, wherein the first and second lead frames comprise inset sidewalls, the inset sidewalls undercutting and surrounding at least three continuous sides of the first surfaces of the first and second lead frames, and at least one of the first surface, the second surface, and the sidewalls of the first and second lead frames partially defining a fixing space;

a light-emitting diode chip arranged on the first surface of the first or second lead frame; and

a resin part disposed in the fixing space to support the first and second lead frames.

13. The light-emitting device of claim 12, wherein the resin part is monolithically disposed on the first surfaces of the first and second lead frames, and in the fixing space.

14. The light-emitting device of claim 12, further comprising a fixing hole formed in at least one of the first and second lead frames, and exposed to the fixing space at one of the inset sidewalls.

15. The light-emitting device of claim 14, wherein the sidewalls comprise stepped portions connected to the inset sidewalls.

16. The light-emitting device of claim 15, wherein:

the fixing space surrounds the at least three continuous sides of each of the first and second lead frames; and

the fixing space is disposed in a facing region between the first and second lead frames.

17. The light-emitting device of claim 16, wherein the resin part is disposed on the first surfaces of the first and second lead frames, extends into the fixing space, and is hooked on the stepped portions.