Multi-chip semiconductor packages and assembly thereof
First Claim
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1. A semiconductor package comprising:
- a substrate comprising a first and a second die attach pad;
a first die disposed over the first die attach pad;
a second die disposed over the second die attach pad, wherein the first die is disposed over a first portion of the first die attach pad and over a first portion of the second die attach pad; and
a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die.
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Accused Products
Abstract
Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die.
15 Citations
16 Claims
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1. A semiconductor package comprising:
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a substrate comprising a first and a second die attach pad; a first die disposed over the first die attach pad; a second die disposed over the second die attach pad, wherein the first die is disposed over a first portion of the first die attach pad and over a first portion of the second die attach pad; and a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor package comprising:
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a substrate comprising a first die attach pad and a second die attach pad; a first die disposed over the first die attach pad, wherein the first die is disposed over a first portion of the first die attach pad and over a first portion of the second die attach pad; a second die disposed over the second die attach pad; a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die; a fourth die disposed over the first die attach pad, the fourth die disposed vertically between the first die attach pad and the first die and vertically between the first die attach pad and the second die; and a fifth die disposed over the second die attach pad, the fifth die disposed vertically between the second die attach pad and the second die and vertically between the second die attach pad and the first die. - View Dependent Claims (11, 12, 13)
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14. A semiconductor package comprising:
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a substrate comprising a first and a second die attach pad; a first die disposed over the first die attach pad; a second die disposed over the second die attach pad, wherein the first die is disposed over a first portion of the first die attach pad and over a first portion of the second die attach pad; a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die; a fourth die disposed over the first die attach pad; a first contact lead coupling the first die to the third die; and a second contact lead coupling the fourth die to the third die, wherein the first contact lead is oriented differently relative to the second contact lead. - View Dependent Claims (15, 16)
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Specification