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Structural adhesive materials

  • US 8,840,813 B2
  • Filed: 06/02/2008
  • Issued: 09/23/2014
  • Est. Priority Date: 06/01/2007
  • Status: Active Grant
First Claim
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1. An adhesive material that provides electrical conductance across a bondline having a thickness in the range between 50 microns and 400 microns, said adhesive material comprising:

  • a) an adhesive polymeric resin that is in the form of a bondline between two substrates wherein the thickness of said bondline is in the range between 50 microns and 400 microns and wherein said adhesive polymeric resin has a lap shear strength; and

    b) low aspect ratio metal-coated additives disbursed in said adhesive polymeric resin; and

    c) high aspect ratio metal-coated additives disbursed in said adhesive polymeric resin in an amount in the range of 2 weight percent to 15 weight percent so as to provide electrical conductance across said bondline and wherein the weight ratio of said high aspect ratio metal-coated additives to said low aspect ratio metal-coated additives is about 3 to 1, wherein the lap shear strength of said adhesive material is equal to or greater than the lap shear strength of said adhesive polymeric resin.

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