Method and system for power transfer utilizing leaky wave antennas

• US 8,843,061 B2
• Filed: 06/09/2010
• Issued: 09/23/2014
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): Nguyen, Duc M
• Application Number:
  US12/797,214
• Publication Number:
  US 20100308668A1
• Time in Patent Office: 1,567 Days
• Field of Search: 455/41.1, 455/41.2, 455/562.1, 455/121, 455/125, 455/272, 455/289
• US Class Current: 455/41.1
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for power transfer utilizing leaky wave antennas (LWAs) are disclosed and may include configuring one or more LWAs in a communication device to receive RF signals that are communicated from one or more other LWAs that are external to the communication device. The communication device may be powered utilizing the RF signals that are received via the configured LWAs. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to receive the RF signals from a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The LWAs may be integrated in integrated circuits, integrated circuit packages, and/or printed circuit boards. The packages may be affixed to printed circuit boards and the integrated circuits may be flip-chip-bonded to the packages.

Claims

1. A method for communication, the method comprising:

in a communication device comprising one or more leaky wave antennas;

configuring said one or more leaky wave antennas to receive an RF signal that is communicated from an RF source that is external to said communication device; and

powering said communication device utilizing said RF signal that is received via said configured one or more leaky wave antennas,

wherein at least one of said one or more leaky wave antennas includes a plurality of impedance feed points and a first surface and a second surface that form a cavity having a cavity height, and each of the impedance feed points is configured to have a different height from each other while the cavity height is the same for each of the impedance feed points.

2. The method according to claim 1, comprising configuring a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1, comprising configuring said one or more leaky wave antennas to communicate said RF signal in a desired direction.

4. The method according to claim 1, wherein said one or more leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein the cavity height of said one or more leaky wave antennas is dependent on spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said one or more leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein the cavity height of said one or more leaky wave antennas is dependent on spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more integrated circuits flip-chip bonded to one or more integrated circuit packages.

9. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.

10. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.

11. A system for enabling communication, the system comprising:

one or more circuits in a communication device comprising one or more leaky wave antennas, said one or more circuits being operable to;

configure said one or more leaky wave antennas to receive an RF signal that is communicated from an RF source that is external to said communication device;

power said communication device utilizing said RF signal that is received via said configured one or more leaky wave antennas;

wherein at least one of said one or more leaky wave antennas includes a plurality of impedance feed points and a first surface and a second surface that form a cavity having a cavity height, and each of the impedance feed points is configured to have a different height from each other while the cavity height is the same for each of the impedance feed points.

12. The system according to claim 11, wherein said one or more circuits are operable to configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11, wherein said one or more circuits are operable to configure said one or more leaky wave antennas to communicate said RF signal in a desired direction.

14. The system according to claim 11, wherein said one or more leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein the cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said one or more leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein the cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more integrated circuits flip-chip bonded to one or more integrated circuit packages.

19. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.

20. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.