Air-release features in cavity packages

• US 8,853,839 B2
• Filed: 10/04/2012
• Issued: 10/07/2014
• Est. Priority Date: 10/07/2011
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Gao, Jia, Yang, Jicheng, Saiyed, Shafi, Ng, Siu Lung, Xue, Xiaojie
• Primary Examiner(s): LE, DUNG ANH
• Application Number:
  US13/645,094
• Publication Number:
  US 20130093031A1
• Time in Patent Office: 733 Days
• Field of Search: 257/676, 257/689, 257/704, 257/698, 257/787, 257713-714
• US Class Current: 257/676
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 29/66007 Multistep manufacturing processes
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Claims

1. A device package comprising:

a package housing defining a cavity;

a motion sensor die mounted within the housing; and

a hole extending through the housing, wherein the housing has a bottom surface comprising at least one electrical lead configured to convey electrical signals between the device package and a external board, the hole extending through the bottom surface.

2. The device package of claim 1, wherein the housing comprises a package substrate and a lid attached to the package substrate, the hole extending through the package substrate.

3. The device package of claim 2, wherein the hole is sized to release air from the cavity when the lid is attached to the package substrate.

4. The device package of claim 2, wherein the lid is attached to the package substrate using an epoxy.

5. The device package of claim 2, wherein the motion sensor die comprises a microelectromechanical systems (MEMS) accelerometer.

6. The device package of claim 2, wherein the motion sensor die comprises a microelectromechanical systems (MEMS) gyroscope.

7. The device package of claim 2, wherein the hole is laterally spaced from the motion sensor die.

8. The device package of claim 2, wherein the package substrate is mounted on and electrically connected to an external board, the hole being sealed to prevent communication therethrough.

9. The device package of claim 8, wherein the hole is sealed by solder or epoxy.

10. The device package of claim 2, wherein the lid comprises a conductive material, and wherein the lid is attached to the package substrate by an epoxy material.

11. The device package of claim 10, wherein the epoxy material is electrically conductive.

12. The device package of claim 2, wherein the package substrate comprises a plastic material.

13. The device package of claim 2, wherein the package substrate comprises a printed circuit board (PCB).

14. The device package of claim 13, comprising an annular metal trace on the bottom surface of the housing, and wherein the annular metal trace surrounds the hole.

15. The device package of claim 14, wherein the annular metal trace is not electrically connected to any circuit.

16. The device package of claim 2, wherein the package substrate comprises a molded leadframe.

17. The device package of claim 16, wherein the device package is a leadframe chip scale package (LFCSP) or a small-outline integrated circuit (SOIC) package.

18. The device package of claim 16, wherein the hole is formed through a metallic portion of the leadframe.

19. The device package of claim 18, wherein the hole is formed through a dummy lead.

20. The device package of claim 16, wherein the hole comprises an upper portion adjacent to an upper surface of the package substrate, and a lower portion adjacent to a bottom surface of the package substrate, wherein the cross-sectional area of the hole is larger in the lower portion than in the upper portion.

21. The device package of claim 2, wherein the lid is shaped to form a concavity.

22. The device package of claim 2, wherein the package substrate includes a base and a wall extending from the base, and wherein the lid is substantially planar.

30. The device package of claim 1, wherein a metal is disposed at least partially around the hole on at least the bottom surface of the housing.

31. The device package of claim 30, wherein the metal substantially surrounds the hole on at least the bottom surface of the housing.

32. The device package of claim 30, further comprising metal on an inner wall of the hole.

33. The device package of claim 32, wherein the housing comprises a package substrate, the package substrate comprising a leadframe, the hole formed through the leadframe.

34. The device package of claim 30, wherein the metal comprises an annular metal ring.

35. The device package of claim 34, wherein the housing comprises a printed circuit board (PCB) substrate and a lid attached to the PCB substrate.

36. The device package of claim 31, wherein the housing comprises a leadframe and a lid attached to a portion of the leadframe, the leadframe comprising the metal.

37. The device package of claim 30, wherein the metal does not electrically communicate with the motion sensor die.

38. The device package of claim 37, wherein the metal is electrically isolated from the other components of the device package.

39. An assembly comprising:

the device package of claim 1;

an external board; and

an adhesive attaching the device package to the external board, the adhesive at least partially filling the hole.

40. The assembly of claim 39, wherein a first portion of the adhesive at least partially fills the hole and a second portion of the adhesive is disposed between the housing and the external board.

41. The assembly of claim 39, wherein the adhesive comprises solder.

42. The assembly of claim 39, wherein the adhesive comprises an epoxy.

43. The assembly of claim 39, wherein a metal is disposed at least partially around the hole on at least the bottom surface of the housing.

44. The assembly of claim 43, wherein the metal substantially surrounds the hole on at least the bottom surface of the housing.

45. The assembly of claim 43, further comprising metal on an inner wall of the hole.

46. The assembly of claim 45, wherein the housing comprises a package substrate, the package substrate comprising a leadframe, the hole formed through the leadframe.

47. The assembly of claim 43, wherein the metal comprises an annular metal ring.

48. The assembly of claim 47, wherein the housing comprises a printed circuit board (PCB) substrate and a lid attached to the PCB substrate.

49. The assembly of claim 44 wherein the housing comprises a leadframe and a lid attached to a portion of the leadframe, the leadframe comprising the metal.

50. The assembly of claim 39, wherein the hole is laterally spaced from the motion sensor die.

51. The assembly of claim 43, wherein the metal does not electrically communicate with the motion sensor die.

52. The assembly of claim 51, wherein the metal is electrically isolated from the other components of the device package.

53. The assembly of claim 39, wherein the motion sensor die comprises a microelectromechanical systems (MEMS) die.

23. A method of integrating a motion sensor device package with an outside electronic circuit, the method comprising:

providing a package substrate with a vent hole therethrough, the package substrate having bottom surface comprising at least one electrical lead configured to convey electrical signals between the device package and an external board, the vent hole extending through the bottom surface;

mounting a motion sensor die on the package substrate; and

attaching a lid to the package substrate to form a housing enclosing the motion sensor die in a cavity but for the vent hole.

24. The method of claim 23, wherein attaching the lid comprises applying epoxy and curing the epoxy at greater than about 150°

C.

25. The method of claim 24, wherein the epoxy is electrically conductive.

26. The method of claim 23, further comprising mounting the package substrate to an external board after attaching the lid.

27. The method of claim 26, wherein mounting the package substrate comprises simultaneously sealing the vent hole.

28. The method of claim 27, wherein the package substrate comprises a molded leadframe, the vent hole is formed in a metal feature of the molded leadframe, and sealing comprises applying solder to the vent hole.

29. The method of claim 27, wherein the package substrate comprises a printed circuit board (PCB) including an annular metal trace surrounding the vent hole, and sealing comprises applying solder to the metal trace.