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Laser diode assembly

  • US 8,867,582 B2
  • Filed: 04/04/2013
  • Issued: 10/21/2014
  • Est. Priority Date: 04/04/2012
  • Status: Active Grant
First Claim
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1. A laser diode assembly, comprising:

  • a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction, wherein the housing part and the mounting part have a main body composed of copper and wherein the housing part is steel coated;

    a laser diode chip disposed on the mounting part, the laser diode chip having a semiconductor layers on a substrate, the semiconductor layers including an active layer for emitting light; and

    a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μ

    m.

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