Wireless IC device and method for manufacturing same
First Claim
1. A wireless integrated circuit device comprising:
- a wireless integrated circuit arranged to process a predetermined wireless signal;
a loop-shaped electrode coupled to the wireless integrated circuit and including a coupling portion; and
a first metallic electrode plate and a second metallic electrode plate coupled to the loop-shaped electrode, the second metallic electrode plate having an area larger than an area of the first metallic electrode plate;
whereinthe wireless integrated circuit and the loop-shaped electrode are sandwiched between the first metallic electrode plate and the second metallic electrode plate;
the loop-shaped electrode is arranged such that a loop surface thereof is perpendicular to or tilted with respect to the first metallic electrode plate and the second metallic electrode plate;
the loop-shaped electrode is directly electrically connected to the first metallic electrode plate via the coupling portion and is electromagnetically coupled to the second metallic electrode plate; and
the first and second metallic electrode plates are used for transmission and reception of the wireless signal.
1 Assignment
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Accused Products
Abstract
A wireless IC device which functions as a non-contact RFID system even when the wireless IC device is attached to an article containing metal, water, salt or the like, without hindering reduction in size and thickness, and a method for manufacturing the same are obtained. The wireless IC device includes a wireless IC chip arranged to process a predetermined wireless signal, a feed circuit board on which the wireless IC chip is mounted, a loop-shaped electrode that is coupled to the wireless IC chip via the feed circuit board, and a first electrode plate and a second electrode plate that are coupled to the loop-shaped electrode. The loop-shaped electrode is sandwiched between the first electrode plate and the second electrode plate and is arranged such that the loop surface thereof is perpendicular to or tilted with respect to the first and the second electrode plates. At least the first electrode plate out of the first electrode plate and the second electrode plate is used for transmission and reception of the wireless signal.
143 Citations
6 Claims
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1. A wireless integrated circuit device comprising:
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a wireless integrated circuit arranged to process a predetermined wireless signal; a loop-shaped electrode coupled to the wireless integrated circuit and including a coupling portion; and a first metallic electrode plate and a second metallic electrode plate coupled to the loop-shaped electrode, the second metallic electrode plate having an area larger than an area of the first metallic electrode plate;
whereinthe wireless integrated circuit and the loop-shaped electrode are sandwiched between the first metallic electrode plate and the second metallic electrode plate; the loop-shaped electrode is arranged such that a loop surface thereof is perpendicular to or tilted with respect to the first metallic electrode plate and the second metallic electrode plate; the loop-shaped electrode is directly electrically connected to the first metallic electrode plate via the coupling portion and is electromagnetically coupled to the second metallic electrode plate; and the first and second metallic electrode plates are used for transmission and reception of the wireless signal. - View Dependent Claims (2, 3, 4, 5)
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6. A method for manufacturing a wireless integrated circuit device that includes a wireless integrated circuit arranged to process a predetermined wireless signal, a loop-shaped electrode coupled to the wireless integrated circuit and including a coupling portion, and a first metallic electrode plate and a second metallic electrode plate coupled to the loop-shaped electrode, the second metallic electrode plate having an area larger than an area of the first metallic electrode plate, wherein the wireless integrated circuit and the loop-shaped electrode are sandwiched between the first metallic electrode plate and the second metallic electrode plate, the loop-shaped electrode is arranged such that a loop surface thereof is perpendicular to or tilted with respect to the first metallic electrode plate and the second metallic electrode plate, the loop-shaped electrode is directly electrically connected to the first metallic electrode plate via the coupling portion and is electromagnetically coupled to the second metallic electrode plate, and the first and second metallic electrode plates are used for transmission and reception of the wireless signal, the method comprising the steps of:
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patterning the first metallic electrode plate and the loop-shaped electrode on a sheet of a metallic plate; and bending the loop-shaped electrode so as to be perpendicular to or tilted with respect to the first metallic electrode plate.
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Specification