Seed layers and process of manufacturing seed layers

• US 8,882,077 B2
• Filed: 01/28/2010
• Issued: 11/11/2014
• Est. Priority Date: 01/30/2009
• Status: Expired due to Fees

• Current Assignee: AMG Idealcast Solar Corporation
• Original Assignee: AMG Idealcast Solar Corporation
• Inventors: Stoddard, Nathan G.
• Primary Examiner(s): Kornakov, Michael
• Assistant Examiner(s): Qi, Hua
• Application Number:
  US12/695,193
• Publication Number:
  US 20100193664A1
• Time in Patent Office: 1,748 Days
• Field of Search: 117/1, 117/88, 117/103, 117/108
• US Class Current: 249/114.1
• CPC Class Codes: C30B 1/023 from solids with amorphous structure
• CPC Class Codes: C30B 11/14 characterised by the seed, e.g. its crystallographic orientation
• CPC Class Codes: C30B 28/04 from liquids
• CPC Class Codes: C30B 28/06 by normal freezing or freezing under temperature gradient
• CPC Class Codes: C30B 29/06 Silicon
• CPC Class Codes: C30B 33/04 using electric or magnetic fields or particle radiation
• CPC Class Codes: C30B 33/06 Joining of crystals
• CPC Class Codes: Y10T 156/1043 Subsequent to assembly

Abstract

This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.

Claims

1. A process for manufacturing silicon seed layers suitable for use in the manufacture of solar cells or solar modules, the process comprising:

positioning tiles with aligned edges to form seams on a suitable surface;

joining the tiles at the seams to form a seed layer;

heating the tiles to partially melt at least a portion of the tiles and close the seams;

cooling the seed layer;

positioning the seed layer with respect to a top side and a bottom side of the seed layer following cooling the seed layer;

reheating the seed layer to melt at least a previously unmelted portion of the seed layer and close the seams; and

recooling the seed layer.

2. The process of claim 1, wherein the cooling comprises a rate of cooling of about 100 degrees Celsius an hour.

3. The process of claim 1, wherein the joining comprises:

contacting the tiles at both ends of at least one seam with electrodes;

flowing electrical current through the tiles between the electrodes to melt at least a portion of the tiles and close the seams;

optionally repeating the contacting and the flowing for each seam in the layer; and

cooling the seed layer.

4. The process of claim 3, wherein the electrodes remain stationary with respect to the tiles during the flowing electrical current.

5. The process of claim 3, wherein at least one electrode moves with respect to the tiles during the flowing of the electrical current.

6. The process of claim 3, wherein the electrodes comprise highly doped silicon.

7. The process of claim 1, wherein the joining comprises plasma deposition of amorphous silicon to close the seams.

8. The process of claim 7, wherein the deposition of amorphous silicon comprises conformal plasma deposition.

9. The process of claim 7, further comprising heating the seed layer to between about 500 degrees Celsius and about 750 degrees Celsius.

10. The process of claim 9, wherein the heating transforms the amorphous silicon to crystalline silicon.

11. The process of claim 7, further comprising a high temperature anneal or heat treatment.

12. The process of claim 7, further comprising tapering one or more sides of the tiles.

13. The process of claim 1, wherein the joining comprises applying photons to close the seams.

14. The process of claim 13, wherein the applying photons comprise laser welding or flash lamp melting of the silicon at the seams.

15. The process of claim 1, wherein the joining comprises layer deposition to close the seams.

16. The process of claim 15, wherein the layer deposition comprises oxidation, chemical vapor deposition, liquid phase solution deposition, plasma-enhanced deposition, molecular beam epitaxy or combinations thereof.

17. The process of claim 15, wherein the layer deposition comprises epitaxial deposition at a temperature of between about 700 degrees Celsius and about 1,100 degrees Celsius.

18. The process of claim 15 further comprising tapering one or more sides of the tiles.

19. The process of claim 1, further comprising polishing one or more sides of the tiles.

20. The process of claim 1, wherein a layer of thick tiles is positioned with a gap of constant width separating every tile while a layer of thin tiles is positioned close-packed adjacent the thick layer.

21. The process of claim 20, further comprising:

introducing molten silicon to fill the gaps, and cooling of the seed layer through the thin layer of tiles.

22. The process of claim 1, where alternating rows of tiles are offset slightly from one another while being fully abutted, to prevent the formation of a four-corner seam junction.

23. The process of claim 1, wherein the tiles comprise monocrystalline material.

24. The process of claim 1, wherein the tiles are aligned to have coincident crystalline orientations.

25. The process of claim 1, wherein the tiles are aligned to have differing crystal orientations, and form seams resulting in specific grain boundaries.

26. The process of claim 25, wherein the specific grain boundaries comprise stable low-energy grain boundaries.