Light-emitting diode

• US 8,890,306 B2
• Filed: 05/24/2011
• Issued: 11/18/2014
• Est. Priority Date: 07/07/2010
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Reill, Joachim, Bogner, Georg, Grtsch, Stefan
• Primary Examiner(s): Menz, Laura
• Assistant Examiner(s): Malek, Maliheh
• Application Number:
  US13/808,300
• Publication Number:
  US 20130207133A1
• Time in Patent Office: 1,274 Days
• Field of Search: 438/22, 438 26- 29, 438/34, 438 38- 39, 438/42, 438106-112, 438118-119, 438121-127, 257/79, 257/88, 257/93, 257 98-100, 257/666, 257675-678, 257/690, 257697-699, 257/706, 257708-712, 257718-720, 257723-725, 257731-733, 257/E23.101, 257/E23.103, 257/E33.001
• US Class Current: 257/699
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core

Abstract

A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.

Claims

1. A light-emitting diode comprising:

a carrier with a mounting face on an upper side of the carrier and at least two light-emitting diode chips affixed to the carrier at the mounting face, wherein the carrier comprises a metallic basic body, an electrically insulating layer affixed to the metallic basic body on the side facing the light-emitting diode chips, and an electrically conductive layer formed directly on the electrically insulating layer, the light-emitting diode chips electrically conductively connected to the electrically conductive layer, the light-emitting diode chips also connected in parallel with one another via the metallic basic body, a further electrically insulating layer is affixed to the carrier on a lower side of the carrier opposite to the upper side of the carrier, and the further electrically insulating layer has a thermal conductivity of at least 2 W/(mK), at least one opening in the carrier extending from the upper side of the carrier to the lower side of the carrier, wherein the at least one opening passing through the carrier completely, and an inner face of the at least one opening being also covered by the further electrically insulating layer; and

the at least one opening provided to accommodate a fixing device to mount the light-emitting diode.

2. The light-emitting diode according to claim 1, wherein the electrically insulating layer is a ceramic layer.

3. The light-emitting diode according to claim 1, wherein the electrically insulating layer has a thickness of 30 μ

m to 100 μ

m.

4. The light-emitting diode according to claim 1, wherein the electrically insulating layer consists of a ceramic material.

5. The light-emitting diode according to claim 1, wherein the electrically insulating layer contains boron nitride or consists of boron nitride.

6. The light-emitting diode according to claim 1, wherein the metallic basic body accounts for at least 90% of the volume of the carrier.

7. The light-emitting diode according to claim 1, wherein the metallic basic body accounts for at least 90% of the weight of the carrier.

8. The light-emitting diode according to claim 1, wherein:

the at least two light-emitting diode chips are embedded in a reflective coating which covers the mounting face and side faces of the light-emitting diode chips, and

the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, wherein the radiation exit surfaces face away from the carrier.

9. The light-emitting diode according to claim 8, wherein the reflective coating appears white under daylight.

10. The light-emitting diode according to claim 1, wherein:

the at least two light-emitting diode chips are embedded in a reflective coating which covers the mounting face and side faces of the light-emitting diode chips, and

the reflective coating terminates flush with radiation exit surfaces of the light-emitting diode chips facing away from the carrier.